用户手册 — Intel 530

目录

• 1 Introduction

  7
  • 1.1 Terminology

    8
  • 1.2 References

    9
• 2 Low Power Features

  11
  • 2.1 Clock Control and Low Power States

    11
    • 2.1.1 Core Low-Power States

      12
    • 2.1.2 Package Low-Power States

      13
  • 2.2 Enhanced Intel SpeedStep® Technology

    15
  • 2.3 Low-Power FSB Features

    16
  • 2.4 Processor Power Status Indicator (PSI#) Signal

    17
• 3 Electrical Specifications

  19
  • 3.1 Power and Ground Pins

    19
  • 3.2 FSB Clock (BCLK[1:0]) and Processor Clocking

    19
  • 3.3 Voltage Identification

    19
  • 3.4 Catastrophic Thermal Protection

    22
  • 3.5 Reserved and Unused Pins

    22
  • 3.6 FSB Frequency Select Signals (BSEL[2:0])

    23
  • 3.7 FSB Signal Groups

    23
  • 3.8 CMOS Signals

    25
  • 3.9 Maximum Ratings

    25
  • 3.10 Processor DC Specifications

    26
• 4 Package Mechanical Specifications and Pin Information

  33
  • 4.1 Package Mechanical Specifications

    33
  • 4.2 Processor Pinout and Pin List

    39
  • 4.3 Alphabetical Signals Reference

    75
• 5 Thermal Specifications and Design Considerations

  83
  • 5.1 Monitoring Die Temperature

    84
    • 5.1.1 Thermal Diode

      85
    • 5.1.2 Thermal Diode Offset

      87
    • 5.1.3 Intel® Thermal Monitor

      88
    • 5.1.4 Digital Thermal Sensor

      89
    • 5.1.5 Out of Specification Detection

      90
    • 5.1.6 PROCHOT# Signal Pin

      90