用户手册 — Intel Core 2 Duo E7300

目录

• 1 Introduction

  11
  • 1.1 Document Goals and Scope

    11
    • 1.1.1 Importance of Thermal Management

      11
    • 1.1.2 Document Goals

      11
    • 1.1.3 Document Scope

      12
  • 1.2 References

    13
  • 1.3 Definition of Terms

    13
• 2 Processor Thermal/Mechanical Information

  15
  • 2.1 Mechanical Requirements

    15
    • 2.1.1 Processor Package

      15
    • 2.1.2 Heatsink Attach

      17
      • 2.1.2.1 General Guidelines

        17
      • 2.1.2.2 Heatsink Clip Load Requirement

        17
      • 2.1.2.3 Additional Guidelines

        18
  • 2.2 Thermal Requirements

    18
    • 2.2.1 Processor Case Temperature

      18
    • 2.2.2 Thermal Profile

      19
    • 2.2.3 Thermal Solution Design Requirements

      19
    • 2.2.4 TCONTROL

      20
  • 2.3 Heatsink Design Considerations

    21
    • 2.3.1 Heatsink Size

      22
    • 2.3.2 Heatsink Mass

      22
    • 2.3.3 Package IHS Flatness

      23
    • 2.3.4 Thermal Interface Material

      23
  • 2.4 System Thermal Solution Considerations

    24
    • 2.4.1 Chassis Thermal Design Capabilities

      24
    • 2.4.2 Improving Chassis Thermal Performance

      24
    • 2.4.3 Summary

      25
  • 2.5 System Integration Considerations

    25
• 3 Thermal Metrology

  27
  • 3.1 Characterizing Cooling Performance Requirements

    27
    • 3.1.1 Example

      28
  • 3.2 Processor Thermal Solution Performance Assessment

    29
  • 3.3 Local Ambient Temperature Measurement Guidelines

    29
  • 3.4 Processor Case Temperature Measurement Guidelines

    32
• 4 Thermal Management Logic and Thermal Monitor Feature

  33
  • 4.1 Processor Power Dissipation

    33
  • 4.2 Thermal Monitor Implementation

    33
    • 4.2.1 PROCHOT# Signal

      34
    • 4.2.2 Thermal Control Circuit

      34
      • 4.2.2.1 Thermal Monitor

        34
    • 4.2.3 Thermal Monitor 2

      35
    • 4.2.4 Operation and Configuration

      36
    • 4.2.5 On-Demand Mode

      37
    • 4.2.6 System Considerations

      37
    • 4.2.7 Operating System and Application Software Considerations

      38
    • 4.2.8 THERMTRIP# Signal

      38
    • 4.2.9 Cooling System Failure Warning

      38
    • 4.2.10 Digital Thermal Sensor

      38
    • 4.2.11 Platform Environmental Control Interface (PECI)

      39
• 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

  41
  • 5.1 Overview of the BTX Reference Design

    41
    • 5.1.1 Target Heatsink Performance

      41
    • 5.1.2 Acoustics

      42
    • 5.1.3 Effective Fan Curve

      43
    • 5.1.4 Voltage Regulator Thermal Management

      44
    • 5.1.5 Altitude

      45
    • 5.1.6 Reference Heatsink Thermal Validation

      45
  • 5.2 Environmental Reliability Testing

    45
    • 5.2.1 Structural Reliability Testing

      45
      • 5.2.1.1 Random Vibration Test Procedure

        45
      • 5.2.1.2 Shock Test Procedure

        46
    • 5.2.2 Power Cycling

      47
    • 5.2.3 Recommended BIOS/CPU/Memory Test Procedures

      48
  • 5.3 Material and Recycling Requirements

    48
  • 5.4 Safety Requirements

    49
  • 5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly

    49
  • 5.6 Preload and TMA Stiffness

    50
    • 5.6.1 Structural Design Strategy

      50
    • 5.6.2 TMA Preload verse Stiffness

      50
• 6 ATX Thermal/Mechanical Design Information

  53
  • 6.1 ATX Reference Design Requirements

    53
  • 6.2 Validation Results for Reference Design

    55
    • 6.2.1 Heatsink Performance

      55
    • 6.2.2 Acoustics

      56
    • 6.2.3 Altitude

      56
    • 6.2.4 Heatsink Thermal Validation

      57
  • 6.3 Environmental Reliability Testing

    57
    • 6.3.1 Structural Reliability Testing

      57
      • 6.3.1.1 Random Vibration Test Procedure

        57
      • 6.3.1.2 Shock Test Procedure

        58
    • 6.3.2 Power Cycling

      59
    • 6.3.3 Recommended BIOS/CPU/Memory Test Procedures

      60
  • 6.4 Material and Recycling Requirements

    60
  • 6.5 Safety Requirements

    61
  • 6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design

    61
  • 6.7 Reference Attach Mechanism

    62
    • 6.7.1 Structural Design Strategy

      62
    • 6.7.2 Mechanical Interface to the Reference Attach Mechanism

      63
• 7 Intel® Quiet System Technology (Intel® QST)

  65
  • 7.1 Intel® QST Algorithm

    65
    • 7.1.1 Output Weighting Matrix

      66
    • 7.1.2 Proportional-Integral-Derivative (PID)

      66
  • 7.2 Board and System Implementation of Intel® QST

    68
  • 7.3 Intel® QST Configuration & Tuning

    70
  • 7.4 Fan Hub Thermistor and Intel® QST

    70