用户手册 — Intel Core Duo T2700

目录

• Contents

  3
• 1 Introduction

  7
  • 1.1 Terminology

    9
  • 1.2 References

    9
• 2 Low Power Features

  11
  • 2.1 Clock Control and Low Power States

    11
    • 2.1.1 Core Low-Power States

      13
      • 2.1.1.1 C0 State

        13
      • 2.1.1.2 C1/AutoHALT Powerdown State

        13
      • 2.1.1.3 C1/MWAIT Powerdown State

        13
      • 2.1.1.4 Core C2 State

        13
      • 2.1.1.5 Core C3 State

        14
      • 2.1.1.6 Core C4 State

        14
    • 2.1.2 Package Low Power States

      14
      • 2.1.2.1 Normal State

        14
      • 2.1.2.2 Stop-Grant State

        14
      • 2.1.2.3 Stop Grant Snoop State

        15
      • 2.1.2.4 Sleep State

        15
      • 2.1.2.5 Deep Sleep State

        16
      • 2.1.2.6 Deeper Sleep State

        16
  • 2.2 Enhanced Intel SpeedStep® Technology

    17
  • 2.3 Extended Low Power States

    18
  • 2.4 FSB Low Power Enhancements

    19
  • 2.5 Processor Power Status Indicator (PSI#) Signal

    19
• 3 Electrical Specifications

  21
  • 3.1 Power and Ground Pins

    21
  • 3.2 FSB Clock (BCLK[1:0]) and Processor Clocking

    21
  • 3.3 Voltage Identification

    21
  • 3.4 Catastrophic Thermal Protection

    24
  • 3.5 Signal Terminations and Unused Pins

    25
  • 3.6 FSB Frequency Select Signals (BSEL[2:0])

    25
  • 3.7 FSB Signal Groups

    25
  • 3.8 CMOS Signals

    27
  • 3.9 Maximum Ratings

    27
  • 3.10 Processor DC Specifications

    28
• 4 Package Mechanical Specifications and Pin Information

  41
  • 4.1 Package Mechanical Specifications

    41
    • 4.1.1 Package Mechanical Drawings

      41
    • 4.1.2 Processor Component Keep-Out Zones

      46
    • 4.1.3 Package Loading Specifications

      46
    • 4.1.4 Processor Mass Specifications

      46
  • 4.2 Processor Pinout and Pin List

    47
  • 4.3 Alphabetical Signals Reference

    49
• 5 Thermal Specifications and Design Considerations

  79
  • 5.1 Thermal Specifications

    85
    • 5.1.1 Thermal Diode

      85
    • 5.1.2 Thermal Diode Offset

      87
    • 5.1.3 Intel® Thermal Monitor

      87
    • 5.1.4 Digital Thermal Sensor (DTS)

      89
    • 5.1.5 Out of Specification Detection

      90
    • 5.1.6 PROCHOT# Signal Pin

      90