用户手册 (AT80601000918AA)目录Intel® Core™ i7 Processor Extreme Edition and Intel® Core™ i7 Processor1Contents3Figures4Tables5Intel® Core™ i7 Processor Extreme Edition and Intel® Core™ i7 Processor Features7Revision History81 Introduction91.1 Terminology101.2 References112 Electrical Specifications132.1 Intel® QPI Differential Signaling132.2 Power and Ground Lands132.3 Decoupling Guidelines132.3.1 VCC, VTTA, VTTD, VDDQ Decoupling142.4 Processor Clocking (BCLK_DP, BCLK_DN)142.4.1 PLL Power Supply142.5 Voltage Identification (VID)142.6 Reserved or Unused Signals172.7 Signal Groups182.8 Test Access Port (TAP) Connection192.9 Platform Environmental Control Interface (PECI) DC Specifications202.9.1 DC Characteristics202.9.2 Input Device Hysteresis212.10 Absolute Maximum and Minimum Ratings212.11 Processor DC Specifications222.11.1 DC Voltage and Current Specification232.11.2 VCC Overshoot Specification292.11.3 Die Voltage Validation303 Package Mechanical Specifications313.1 Package Mechanical Drawing313.2 Processor Component Keep-Out Zones343.3 Package Loading Specifications343.4 Package Handling Guidelines343.5 Package Insertion Specifications343.6 Processor Mass Specification353.7 Processor Materials353.8 Processor Markings353.9 Processor Land Coordinates364 Land Listing375 Signal Definitions735.1 Signal Definitions736 Thermal Specifications776.1 Package Thermal Specifications776.1.1 Thermal Specifications776.1.2 Thermal Metrology816.2 Processor Thermal Features826.2.1 Processor Temperature826.2.2 Adaptive Thermal Monitor826.2.3 THERMTRIP# Signal856.3 Platform Environment Control Interface (PECI)856.3.1 Introduction856.3.2 PECI Specifications876.4 Storage Conditions Specifications887 Features897.1 Power-On Configuration (POC)897.2 Clock Control and Low Power States897.2.1 Thread and Core Power State Descriptions907.2.2 Package Power State Descriptions917.3 Sleep States927.4 ACPI P-States (Intel® Turbo Boost Technology)927.5 Enhanced Intel SpeedStep® Technology938 Boxed Processor Specifications958.1 Introduction958.2 Mechanical Specifications968.2.1 Boxed Processor Cooling Solution Dimensions968.2.2 Boxed Processor Fan Heatsink Weight988.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly988.3 Electrical Requirements988.3.1 Fan Heatsink Power Supply988.4 Thermal Specifications998.4.1 Boxed Processor Cooling Requirements998.4.2 Variable Speed Fan101文件大小: 829.5 KB页数: 102Language: English打开用户手册