用户手册 (AT80602000798AA)目录1 Introduction91.1 Terminology101.2 References122 Intel® Xeon® Processors 5500 Series Electrical Specifications132.1 Processor Signaling132.1.1 Intel QuickPath Interconnect132.1.2 DDR3 Signal Groups132.1.3 Platform Environmental Control Interface (PECI)142.1.4 Processor Sideband Signals142.1.5 System Reference Clock142.1.6 Test Access Port (TAP) Signals152.1.7 Power / Other Signals152.1.8 Reserved or Unused Signals232.2 Signal Group Summary232.3 Mixing Processors252.4 Flexible Motherboard Guidelines (FMB)262.5 Absolute Maximum and Minimum Ratings262.6 Processor DC Specifications282.6.1 VCC Overshoot Specifications312.6.2 Die Voltage Validation323 Package Mechanical Specifications433.1 Package Mechanical Specifications433.1.1 Package Mechanical Drawing443.1.2 Processor Component Keep-Out Zones473.1.3 Package Loading Specifications473.1.4 Package Handling Guidelines473.1.5 Package Insertion Specifications473.1.6 Processor Mass Specification483.1.7 Processor Materials483.1.8 Processor Markings483.1.9 Processor Land Coordinates484 Land Listing494.1 Intel® Xeon® Processors 5500 Series Pin Assignments494.1.1 Land Listing by Land Name494.1.2 Land Listing by Land Number675 Signal Definitions855.1 Signal Definitions856 Thermal Specifications896.1 Package Thermal Specifications896.1.1 Thermal Specifications896.1.2 Thermal Metrology1036.2 Processor Thermal Features1046.2.1 Processor Temperature1046.2.2 Adaptive Thermal Monitor1046.2.3 On-Demand Mode1066.2.4 PROCHOT# Signal1066.2.5 THERMTRIP# Signal1076.3 Platform Environment Control Interface (PECI)1076.3.1 PECI Client Capabilities1086.3.2 Client Command Suite1096.3.3 Multi-Domain Commands1256.3.4 Client Responses1256.3.5 Originator Responses1266.3.6 Temperature Data1276.3.7 Client Management1287 Features1317.1 Power-On Configuration (POC)1317.2 Clock Control and Low Power States1327.2.1 Thread and Core Power State Descriptions1337.2.2 Package Power State Descriptions1347.2.3 Intel® Xeon® Processor 5500 Series C-State Power Specifications1357.3 Sleep States1367.4 Intel® Turbo Boost Technology1367.5 Enhanced Intel SpeedStep® Technology1368 Boxed Processor Specifications1378.1 Introduction1378.1.1 Available Boxed Thermal Solution Configurations1378.1.2 An Intel “Combo” Boxed Passive / Active Combination Heat Sink Solution1378.1.3 Intel Boxed “Active” Heat Sink Solution1388.1.4 Intel Boxed 25.5mm Tall Passive Heat Sink Solution1398.2 Mechanical Specifications1408.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1408.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1498.3 Fan Power Supply (“Combo” and “Active” Solution)1508.3.1 Boxed Processor Cooling Requirements1518.4 Boxed Processor Contents153文件大小： 4.0 MB页数： 154Language: English打开用户手册
用户手册 (INXEONE5506)目录1 Introduction91.1 Terminology101.2 References122 Intel® Xeon® Processors 5500 Series Electrical Specifications132.1 Processor Signaling132.1.1 Intel QuickPath Interconnect132.1.2 DDR3 Signal Groups132.1.3 Platform Environmental Control Interface (PECI)142.1.4 Processor Sideband Signals142.1.5 System Reference Clock142.1.6 Test Access Port (TAP) Signals152.1.7 Power / Other Signals152.1.8 Reserved or Unused Signals232.2 Signal Group Summary232.3 Mixing Processors252.4 Flexible Motherboard Guidelines (FMB)262.5 Absolute Maximum and Minimum Ratings262.6 Processor DC Specifications282.6.1 VCC Overshoot Specifications312.6.2 Die Voltage Validation323 Package Mechanical Specifications433.1 Package Mechanical Specifications433.1.1 Package Mechanical Drawing443.1.2 Processor Component Keep-Out Zones473.1.3 Package Loading Specifications473.1.4 Package Handling Guidelines473.1.5 Package Insertion Specifications473.1.6 Processor Mass Specification483.1.7 Processor Materials483.1.8 Processor Markings483.1.9 Processor Land Coordinates484 Land Listing494.1 Intel® Xeon® Processors 5500 Series Pin Assignments494.1.1 Land Listing by Land Name494.1.2 Land Listing by Land Number675 Signal Definitions855.1 Signal Definitions856 Thermal Specifications896.1 Package Thermal Specifications896.1.1 Thermal Specifications896.1.2 Thermal Metrology1036.2 Processor Thermal Features1046.2.1 Processor Temperature1046.2.2 Adaptive Thermal Monitor1046.2.3 On-Demand Mode1066.2.4 PROCHOT# Signal1066.2.5 THERMTRIP# Signal1076.3 Platform Environment Control Interface (PECI)1076.3.1 PECI Client Capabilities1086.3.2 Client Command Suite1096.3.3 Multi-Domain Commands1256.3.4 Client Responses1256.3.5 Originator Responses1266.3.6 Temperature Data1276.3.7 Client Management1287 Features1317.1 Power-On Configuration (POC)1317.2 Clock Control and Low Power States1327.2.1 Thread and Core Power State Descriptions1337.2.2 Package Power State Descriptions1347.2.3 Intel® Xeon® Processor 5500 Series C-State Power Specifications1357.3 Sleep States1367.4 Intel® Turbo Boost Technology1367.5 Enhanced Intel SpeedStep® Technology1368 Boxed Processor Specifications1378.1 Introduction1378.1.1 Available Boxed Thermal Solution Configurations1378.1.2 An Intel “Combo” Boxed Passive / Active Combination Heat Sink Solution1378.1.3 Intel Boxed “Active” Heat Sink Solution1388.1.4 Intel Boxed 25.5mm Tall Passive Heat Sink Solution1398.2 Mechanical Specifications1408.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1408.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1498.3 Fan Power Supply (“Combo” and “Active” Solution)1508.3.1 Boxed Processor Cooling Requirements1518.4 Boxed Processor Contents153文件大小： 4.0 MB页数： 154Language: English打开用户手册
