用户手册 (AW8063801108900)目录Mobile 3rd Generation Intel® Core™ Processor Family11 Introduction111.1 Processor Feature Details131.1.1 Supported Technologies131.2 Interfaces131.2.1 System Memory Support131.2.2 PCI Express*141.2.3 Direct Media Interface (DMI)151.2.4 Platform Environment Control Interface (PECI)161.2.5 Processor Graphics161.2.6 Embedded DisplayPort* (eDP*)171.2.7 Intel® Flexible Display Interface (Intel® FDI)171.3 Power Management Support171.3.1 Processor Core171.3.2 System171.3.3 Memory Controller171.3.4 PCI Express*171.3.5 DMI171.3.6 Processor Graphics Controller (GT)181.3.7 Thermal Management Support181.4 Mobile 3rd Generation Intel® Core™ Processor Family SKU Definition181.5 Package181.6 Processor Compatibility191.7 Terminology201.8 Related Documents222 Interfaces232.1 System Memory Interface232.1.1 System Memory Technology Supported232.1.2 System Memory Timing Support242.1.3 System Memory Organization Modes252.1.3.1 Single-Channel Mode252.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode252.1.4 Rules for Populating Memory Slots262.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)272.1.5.1 Just-in-Time Command Scheduling272.1.5.2 Command Overlap272.1.5.3 Out-of-Order Scheduling272.1.6 Data Scrambling272.1.7 DRAM Clock Generation272.1.8 DDR3 Reference Voltage Generation282.2 PCI Express* Interface282.2.1 PCI Express* Architecture282.2.1.1 Transaction Layer292.2.1.2 Data Link Layer292.2.1.3 Physical Layer292.2.2 PCI Express* Configuration Mechanism302.2.3 PCI Express* Graphics312.2.3.1 PCI Express* Lanes Connection312.3 Direct Media Interface (DMI)322.3.1 DMI Error Flow322.3.2 Processor/PCH Compatibility Assumptions322.3.3 DMI Link Down322.4 Processor Graphics Controller (GT)322.4.1 3D and Video Engines for Graphics Processing332.4.1.1 3D Engine Execution Units332.4.1.2 3D Pipeline342.4.1.3 Video Engine342.4.1.4 2D Engine352.4.2 Processor Graphics Display362.4.2.1 Display Planes362.4.2.2 Display Pipes372.4.2.3 Display Ports372.4.2.4 Embedded DisplayPort (eDP)372.4.3 Intel® Flexible Display Interface372.4.4 Multi Graphics Controllers Multi-Monitor Support382.5 Platform Environment Control Interface (PECI)382.6 Interface Clocking382.6.1 Internal Clocking Requirements383 Technologies393.1 Intel® Virtualization Technology393.1.1 Intel® VT-x Objectives393.1.2 Intel® VT-x Features403.1.3 Intel® VT-d Objectives403.1.4 Intel® VT-d Features403.1.5 Intel® VT-d Features Not Supported413.2 Intel® Trusted Execution Technology (Intel® TXT)413.3 Intel® Hyper-Threading Technology423.4 Intel® Turbo Boost Technology423.4.1 Intel®Turbo Boost Technology Frequency433.4.2 Intel® Turbo Boost Technology Graphics Frequency433.5 Intel® Advanced Vector Extensions (AVX)443.6 Security and Cryptography Technologies443.6.1 Advanced Encryption Standard New Instructions (AES-NI)443.6.2 PCLMULQDQ Instruction443.6.3 RDRAND Instruction453.7 Intel® 64 Architecture x2APIC453.8 Supervisor Mode Execution Protection (SMEP)463.9 Power Aware Interrupt Routing (PAIR)464 Power Management474.1 ACPI States Supported484.1.1 System States484.1.2 Processor Core/Package Idle States484.1.3 Integrated Memory Controller States484.1.4 PCI Express* Link States494.1.5 DMI States494.1.6 Processor Graphics Controller States494.1.7 Interface State Combinations494.2 Processor Core Power Management504.2.1 Enhanced Intel® SpeedStep® Technology504.2.2 Low-Power Idle States514.2.3 Requesting Low-Power Idle States524.2.4 Core C-states534.2.4.1 Core C0 State534.2.4.2 Core C1/C1E State534.2.4.3 Core C3 State534.2.4.4 Core C6 State534.2.4.5 Core C7 State544.2.4.6 C-State Auto-Demotion544.2.5 Package C-States544.2.5.1 Package C0564.2.5.2 Package C1/C1E564.2.5.3 Package C3 State564.2.5.4 Package C6 State564.2.5.5 Package C7 State574.2.5.6 Dynamic L3 Cache Sizing574.3 IMC Power Management574.3.1 Disabling Unused System Memory Outputs574.3.2 DRAM Power Management and Initialization584.3.2.1 Initialization Role of CKE594.3.2.2 Conditional Self-Refresh594.3.2.3 Dynamic Power Down Operation604.3.2.4 DRAM I/O Power Management604.3.3 DDR Electrical Power Gating (EPG)604.4 PCI Express* Power Management614.5 DMI Power Management614.6 Graphics Power Management614.6.1 Intel® Rapid Memory Power Management (RMPM) (also known as CxSR)614.6.2 Intel® Graphics Performance Modulation Technology (GPMT)614.6.3 Graphics Render C-State624.6.4 Intel® Smart 2D Display Technology (Intel® S2DDT)624.6.5 Intel® Graphics Dynamic Frequency624.6.6 Display Power Savings Technology 6.0 (DPST)634.6.7 Automatic Display Brightness (ADB)634.6.8 Seamless Display Refresh Rate Switching Technology (SDRRST)634.7 Graphics Thermal Power Management645 Thermal Management655.1 Thermal Considerations655.2 Intel® Turbo Boost Technology Power Monitoring655.3 Intel® Turbo Boost Technology Power Control665.3.1 Package Power Control665.3.2 Power Plane Control685.3.3 Turbo Time Parameter685.4 Configurable TDP and Low Power Mode685.4.1 Configurable TDP685.4.2 Low Power Mode695.5 Thermal and Power Specifications705.6 Thermal Management Features735.6.1 Adaptive Thermal Monitor735.6.1.1 TCC Activation Offset745.6.1.2 Frequency/Voltage Control745.6.1.3 Clock Modulation765.6.2 Digital Thermal Sensor765.6.2.1 Digital Thermal Sensor Accuracy (Taccuracy)775.6.2.2 Fan Speed Control with Digital Thermal Sensor775.6.3 PROCHOT# Signal775.6.3.1 Bi-Directional PROCHOT#775.6.3.2 Voltage Regulator Protection versus PROCHOT#785.6.3.3 Thermal Solution Design and PROCHOT# Behavior785.6.3.4 Low-Power States and PROCHOT# Behavior785.6.3.5 THERMTRIP# Signal795.6.3.6 Critical Temperature Detection795.6.4 On-Demand Mode795.6.4.1 MSR Based On-Demand Mode795.6.4.2 I/O Emulation-Based On-Demand Mode795.6.5 Memory Thermal Management805.6.6 Platform Environment Control Interface (PECI)806 Signal Description816.1 System Memory Interface826.2 Memory Reference and Compensation846.3 Reset and Miscellaneous Signals846.4 PCI Express*-based Interface Signals856.5 Embedded DisplayPort (eDP)856.6 Intel® Flexible Display Interface Signals856.7 Direct Media Interface (DMI)866.8 Phase Lock Loop (PLL) Signals866.9 Test Access Points (TAP) Signals866.10 Error and Thermal Protection876.11 Power Sequencing886.12 Processor Power Signals896.13 Sense Signals896.14 Ground and NCTF906.15 Processor Internal Pull-Up / Pull-Down907 Electrical Specifications917.1 Power and Ground Pins917.2 Decoupling Guidelines917.2.1 Voltage Rail Decoupling917.2.2 PLL Power Supply917.3 Voltage Identification (VID)927.4 System Agent (SA) Vcc VID957.5 Reserved or Unused Signals957.6 Signal Groups967.7 Test Access Port (TAP) Connection987.8 Component Storage Condition Specifications (Prior to Board Attach)987.9 DC Specifications997.9.1 Voltage and Current Specifications997.10 Platform Environmental Control Interface (PECI) DC Specifications1067.10.1 PECI Bus Architecture1067.10.2 PECI DC Characteristics1077.10.3 Input Device Hysteresis1078 Processor Pin, Signal, and Package Information1098.1 Processor Pin Assignments1098.2 Package Mechanical Information1569 DDR Data Swizzling165文件大小： 4.1 MB页数： 168Language: English打开用户手册
用户手册 (AV8063801109800)目录Desktop 3rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family1Revision History81 Introduction91.1 Processor Feature Details111.1.1 Supported Technologies111.2 Interfaces111.2.1 System Memory Support111.2.2 PCI Express*121.2.3 Direct Media Interface (DMI)141.2.4 Platform Environment Control Interface (PECI)141.2.5 Processor Graphics141.2.6 Intel® Flexible Display Interface (Intel® FDI)151.3 Power Management Support151.3.1 Processor Core151.3.2 System151.3.3 Memory Controller151.3.4 PCI Express*151.3.5 Direct Media Interface (DMI)161.3.6 Processor Graphics Controller (GT)161.3.7 Thermal Management Support161.4 Processor SKU Definitions161.5 Package171.6 Processor Compatibility181.7 Terminology191.8 Related Documents222 Interfaces232.1 System Memory Interface232.1.1 System Memory Technology Supported232.1.2 System Memory Timing Support242.1.3 System Memory Organization Modes252.1.3.1 Single-Channel Mode252.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode252.1.4 Rules for Populating Memory Slots262.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)272.1.5.1 Just-in-Time Command Scheduling272.1.5.2 Command Overlap272.1.5.3 Out-of-Order Scheduling272.1.6 Data Scrambling272.1.7 DDR3 Reference Voltage Generation272.2 PCI Express* Interface282.2.1 PCI Express* Architecture282.2.1.1 Transaction Layer292.2.1.2 Data Link Layer292.2.1.3 Physical Layer292.2.2 PCI Express* Configuration Mechanism302.2.3 PCI Express* Port312.2.3.1 PCI Express* Lanes Connection312.3 Direct Media Interface (DMI)322.3.1 DMI Error Flow322.3.2 Processor / PCH Compatibility Assumptions322.3.3 DMI Link Down322.4 Processor Graphics Controller (GT)332.4.1 3D and Video Engines for Graphics Processing332.4.1.1 3D Engine Execution Units332.4.1.2 3D Pipeline342.4.1.3 Video Engine342.4.1.4 2D Engine352.4.2 Processor Graphics Display362.4.2.1 Display Planes362.4.2.2 Display Pipes372.4.2.3 Display Ports372.4.3 Intel® Flexible Display Interface (Intel® FDI)372.4.4 Multi Graphics Controllers Multi-Monitor Support372.5 Platform Environment Control Interface (PECI)382.6 Interface Clocking382.6.1 Internal Clocking Requirements383 Technologies393.1 Intel® Virtualization Technology (Intel® VT)393.1.1 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Objectives393.1.2 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Features403.1.3 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Objectives403.1.4 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features413.1.5 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features Not Supported413.2 Intel® Trusted Execution Technology (Intel® TXT)423.3 Intel® Hyper-Threading Technology (Intel® HT Technology)423.4 Intel® Turbo Boost Technology433.4.1 Intel® Turbo Boost Technology Frequency433.4.2 Intel® Turbo Boost Technology Graphics Frequency433.5 Intel® Advanced Vector Extensions (Intel® AVX)443.6 Security and Cryptography Technologies443.6.1 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)443.6.2 PCLMULQDQ Instruction443.6.3 RDRAND Instruction453.7 Intel® 64 Architecture x2APIC453.8 Supervisor Mode Execution Protection (SMEP)463.9 Power Aware Interrupt Routing (PAIR)464 Power Management474.1 Advanced Configuration and Power Interface (ACPI) States Supported484.1.1 System States484.1.2 Processor Core / Package Idle States484.1.3 Integrated Memory Controller States484.1.4 PCI Express* Link States494.1.5 Direct Media Interface (DMI) States494.1.6 Processor Graphics Controller States494.1.7 Interface State Combinations494.2 Processor Core Power Management504.2.1 Enhanced Intel® SpeedStep® Technology504.2.2 Low-Power Idle States504.2.3 Requesting Low-Power Idle States524.2.4 Core C-states524.2.4.1 Core C0 State524.2.4.2 Core C1 / C1E State534.2.4.3 Core C3 State534.2.4.4 Core C6 State534.2.4.5 C-State Auto-Demotion534.2.5 Package C-States544.2.5.1 Package C0554.2.5.2 Package C1/C1E554.2.5.3 Package C3 State564.2.5.4 Package C6 State564.3 Integrated Memory Controller (IMC) Power Management564.3.1 Disabling Unused System Memory Outputs564.3.2 DRAM Power Management and Initialization574.3.2.1 Initialization Role of CKE584.3.2.2 Conditional Self-Refresh584.3.2.3 Dynamic Power Down Operation594.3.2.4 DRAM I/O Power Management594.3.3 DDR Electrical Power Gating (EPG)594.4 PCI Express* Power Management604.5 DMI Power Management604.6 Graphics Power Management604.6.1 Intel® Rapid Memory Power Management (Intel® RMPM) (also known as CxSR)604.6.2 Intel® Graphics Performance Modulation Technology (Intel® GPMT)604.6.3 Graphics Render C-State604.6.4 Intel® Smart 2D Display Technology (Intel® S2DDT)614.6.5 Intel® Graphics Dynamic Frequency614.7 Graphics Thermal Power Management615 Thermal Management636 Signal Description656.1 System Memory Interface Signals666.2 Memory Reference and Compensation Signals676.3 Reset and Miscellaneous Signals686.4 PCI Express*-based Interface Signals696.5 Intel® Flexible Display (Intel® FDI) Interface Signals696.6 Direct Media Interface (DMI) Signals706.7 Phase Lock Loop (PLL) Signals706.8 Test Access Points (TAP) Signals706.9 Error and Thermal Protection Signals716.10 Power Sequencing Signals726.11 Processor Power Signals736.12 Sense Signals736.13 Ground and Non-Critical to Function (NCTF) Signals746.14 Processor Internal Pull-Up / Pull-Down Resistors747 Electrical Specifications757.1 Power and Ground Lands757.2 Decoupling Guidelines757.2.1 Voltage Rail Decoupling757.3 Processor Clocking (BCLK[0], BCLK#[0])767.3.1 Phase Lock Loop (PLL) Power Supply767.4 VCC Voltage Identification (VID)767.5 System Agent (SA) VCC VID807.6 Reserved or Unused Signals807.7 Signal Groups807.8 Test Access Port (TAP) Connection827.9 Storage Conditions Specifications837.10 DC Specifications847.10.1 Voltage and Current Specifications847.11 Platform Environmental Control Interface (PECI) DC Specifications907.11.1 PECI Bus Architecture907.11.2 DC Characteristics917.11.3 Input Device Hysteresis918 Processor Land and Signal Information938.1 Processor Land Assignments939 DDR Data Swizzling109文件大小： 771.7 KB页数： 112Language: English打开用户手册
