用户手册 (AT80604004875AA)目录1 Introduction91.1 Terminology91.2 References111.3 State of Data112 Electrical Specifications132.1 Processor Maximum Ratings132.2 Socket Voltage Identification142.3 Signal Groups202.4 Processor DC Specifications212.5 Intel® QPI and Intel® SMI Interface Differential Signaling262.5.1 Intel® QPI Signaling Specifications272.5.2 Intel® QPI Electrical Specifications312.5.3 Intel® SMI Signaling Specifications352.5.4 Intel® SMI Transmitter and Receiver Specifications352.6 Platform Environmental Control Interface (PECI) DC Specifications422.6.1 DC Characteristics422.6.2 Input Device Hysteresis422.7 DC Specifications432.8 AC Specifications442.9 Processor AC Timing Waveforms502.10 Flexible Motherboard Guidelines562.11 Reserved (RSVD) or Unused Signals562.12 Test Access Port Connection562.13 Mixing Processors562.14 Processor SPD Interface563 Processor Package Mechanical Specifications573.1 Package Mechanical Specifications573.1.1 Package Mechanical Drawing583.1.2 Processor Component Keep-Out Zones613.1.3 Package Loading Specifications613.1.4 Package Handling Guidelines613.1.5 Package Insertion Specifications613.1.6 Processor Mass Specification623.1.7 Processor Materials623.1.8 Processor Markings623.1.9 Processor Land Coordinates634 Land Listing654.1 Intel® Xeon® Processor 7500 Series Package Bottom Pin Assignments654.1.1 Intel® Xeon® Processor 7500 Series Pin List, Sorted by Land Name654.1.2 Intel® Xeon® Processor 7500 Series Pin List, Sorted by Land Number855 Signal Definitions1056 Thermal Specifications1116.1 Package Thermal Specifications1116.1.1 Thermal Specifications1116.1.2 Thermal Metrology1176.2 Processor Thermal Features1186.2.1 Thermal Monitor Features1186.2.2 Intel® Thermal Monitor 11186.2.3 Intel® Thermal Monitor 21186.2.4 On-Demand Mode1196.2.5 PROCHOT_N Signal1206.2.6 FORCE_PR_N Signal1206.2.7 THERMTRIP_N Signal1216.2.8 THERMALERT_N Signal1216.3 Platform Environment Control Interface (PECI)1216.3.1 PECI Client Capabilities1226.3.2 Client Command Suite1236.3.3 Multi-Domain Commands1396.3.4 Client Responses1396.3.5 Originator Responses1406.3.6 Temperature Data1416.3.7 Client Management1427 Features1457.1 Introduction1457.2 Clock Control and Low Power States1467.2.1 Intel® Xeon® Processor 7500 Series C-State Power Specifications1467.3 Sideband Access to Processor Information ROM via SMBus1467.3.1 Processor Information ROM1467.3.2 Scratch EEPROM1487.3.3 PIROM and Scratch EEPROM Supported SMBus Transactions1497.4 SMBus Memory Component Addressing1497.5 Managing Data in the PIROM1507.5.1 Header1507.5.2 Processor Data1547.5.3 Processor Core Data1567.5.4 Processor Uncore Data1597.5.5 Package Data1647.5.6 Part Number Data1657.5.7 Thermal Reference Data1677.5.8 Feature Data1697.5.9 Other Data1717.5.10 Checksums172文件大小: 1.7 MB页数: 172Language: English打开用户手册