用户手册 (AU80610006240AA)目录Intel® Atom™ Processor N400 Series1Revision History71 Introduction81.1 Processor Features81.2 Interfaces91.2.1 System Memory Support91.2.2 Direct Media Interface Features91.2.3 Integrated Graphics Controller101.3 Clocking101.4 Power Management Support111.5 Package111.6 Terminology111.7 References121.8 System Block Diagram132 Signal Description142.1 Processor Legacy Signals152.2 System Memory Interface182.3 Reset and Miscellaneous Signals192.4 DMI - Direct Media Interface202.5 PLL Signals212.6 Analog Display Signals212.7 LVDS Signals222.8 TAP Signals222.9 Error and Thermal Protection232.10 Processor Core Power Signals232.11 Graphics, DMI and Memory Core Power Signals242.12 Ground243 Functional Description253.1 Integrated Memory Controller253.1.1 System Memory Organization Modes253.1.2 System Memory Technology Supported253.1.3 Rules for populating SO-DIMM slots263.1.4 Intel® Fast Memory Access (Intel® FMA) Technology Enhancements263.1.5 DRAM Clock Generation273.2 Integrated Graphics Controller283.2.1 3D Graphics Pipeline283.2.2 Video Engine293.2.3 2D Engine303.2.4 Display Pipes313.2.5 Display Ports313.2.6 VESA/VGA Mode353.2.7 Multiple Display Configurations353.3 Thermal Sensor353.3.1 PCI Device 0, Function 0353.4 Power Management363.5 Intel® Hyper-Threading Technology364 Electrical Specifications374.1 Power and Ground Balls374.2 Decoupling Guidelines374.2.1 Voltage Rail Decoupling374.3 Processor Clocking374.3.1 PLL Power Supply384.4 Voltage Identification (VID)384.5 Catastrophic Thermal Protection404.6 Reserved or Unused Signals404.7 Signal Groups404.8 Test Access Port (TAP) Connection414.9 Absolute Maximum and Minimum Ratings414.10 DC Specifications424.10.1 Voltage and Current Specifications424.10.2 Interface DC Specifications465 Power Management525.1 ACPI States Supported525.1.1 System States525.1.2 Processor Idle States525.1.3 Integrated Graphics Display States535.1.4 Integrated Memory Controller States535.1.5 DMI States535.1.6 Interface State Combinations535.2 Processor Core Power Management545.2.1 Enhanced Intel® SpeedStep Technology545.2.2 Dynamic Cache Sizing555.2.3 Low-Power Idle States555.2.4 Thread C-states Description585.2.5 Processor Core/Package C-states Description595.3 External Thermal Sensor PM_EXTTS1#: Implementation for Fast C4/C4E Exit626 Thermal Specifications and Design Considerations646.1 Thermal Specifications646.1.1 Thermal Diode656.1.2 Intel® Thermal Monitor676.1.3 Digital Thermal Sensor696.1.4 Out of Specification Detection706.1.5 PROCHOT# Signal Pin707 Package Mechanical Specifications and Ball Information727.1 Package Mechanical Specifications727.1.1 Package Mechanical Drawings727.1.2 Package Loading Specifications737.2 Processor Ballout Assignment73文件大小: 643.9 KB页数: 85Language: English打开用户手册