用户手册 — Intel W3540

目录

• Contents

  3
• Figures

  4
• Tables

  5
• Intel® Xeon® Processor 3500 Series Features

  6
• Revision History

  7
• Intel® Xeon® Processor 3500 Series

  1
• 1 Introduction

  9
  • 1.1 Terminology

    10
  • 1.2 References

    11
• 2 Electrical Specifications

  13
  • 2.1 Intel® QPI Differential Signaling

    13
  • 2.2 Power and Ground Lands

    13
  • 2.3 Decoupling Guidelines

    13
    • 2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling

      14
  • 2.4 Processor Clocking (BCLK_DP, BCLK_DN)

    14
    • 2.4.1 PLL Power Supply

      14
  • 2.5 Voltage Identification (VID)

    14
  • 2.6 Reserved or Unused Signals

    17
  • 2.7 Signal Groups

    18
  • 2.8 Test Access Port (TAP) Connection

    19
  • 2.9 Platform Environmental Control Interface (PECI) DC Specifications

    20
    • 2.9.1 DC Characteristics

      20
    • 2.9.2 Input Device Hysteresis

      21
  • 2.10 Absolute Maximum and Minimum Ratings

    21
  • 2.11 Processor DC Specifications

    22
    • 2.11.1 DC Voltage and Current Specification

      23
    • 2.11.2 VCC Overshoot Specification

      29
    • 2.11.3 Die Voltage Validation

      30
• 3 Package Mechanical Specifications

  31
  • 3.1 Package Mechanical Drawing

    31
  • 3.2 Processor Component Keep-Out Zones

    34
  • 3.3 Package Loading Specifications

    34
  • 3.4 Package Handling Guidelines

    34
  • 3.5 Package Insertion Specifications

    34
  • 3.6 Processor Mass Specification

    35
  • 3.7 Processor Materials

    35
  • 3.8 Processor Markings

    35
  • 3.9 Processor Land Coordinates

    36
• 4 Intel® Xeon® Processor 3500 Series Land Listing

  37
  • 4.1 Intel Xeon Processor 3500 Series Land Assignments

    37
    • 4.1.1 Land Listing by Land Name

      38
    • 4.1.2 Land Listing by Land Number

      56
• 5 Signal Definitions

  75
  • 5.1 Signal Definitions

    75
• 6 Thermal Specifications

  79
  • 6.1 Package Thermal Specifications

    79
    • 6.1.1 Thermal Specifications

      79
    • 6.1.2 Thermal Metrology

      83
  • 6.2 Processor Thermal Features

    84
    • 6.2.1 Processor Temperature

      84
    • 6.2.2 Adaptive Thermal Monitor

      84
    • 6.2.3 THERMTRIP# Signal

      87
  • 6.3 Platform Environment Control Interface (PECI)

    88
    • 6.3.1 Introduction

      88
    • 6.3.2 PECI Specifications

      89
  • 6.4 Storage Conditions Specifications

    90
• 7 Features

  93
  • 7.1 Power-On Configuration (POC)

    93
  • 7.2 Clock Control and Low Power States

    93
    • 7.2.1 Thread and Core Power State Descriptions

      94
    • 7.2.2 Package Power State Descriptions

      95
  • 7.3 Sleep States

    96
  • 7.4 ACPI P-States (Intel® Turbo Boost Technology)

    96
  • 7.5 Enhanced Intel SpeedStep® Technology

    97
• 8 Boxed Processor Specifications

  99
  • 8.1 Introduction

    99
  • 8.2 Mechanical Specifications

    100
    • 8.2.1 Boxed Processor Cooling Solution Dimensions

      100
    • 8.2.2 Boxed Processor Fan Heatsink Weight

      102
    • 8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      102
  • 8.3 Electrical Requirements

    102
    • 8.3.1 Fan Heatsink Power Supply

      102
  • 8.4 Thermal Specifications

    103
    • 8.4.1 Boxed Processor Cooling Requirements

      103
    • 8.4.2 Variable Speed Fan

      105