用户手册 — Intel X3360

目录

• Quad-Core Intel® Xeon® Processor

  1
• 3300 Series

  1
• Contents

  3
• Figures

  4
• Tables

  5
  • Revision History

    6
• Quad-Core Intel® Xeon® Processor 3300 Series Features

  7
• 1 Introduction

  9
  • 1.1 Terminology

    9
    • 1.1.1 Processor Terminology Definitions

      10
  • 1.2 References

    11
• 2 Electrical Specifications

  13
  • 2.1 Power and Ground Lands

    13
  • 2.2 Decoupling Guidelines

    13
    • 2.2.1 Vcc Decoupling

      13
    • 2.2.2 Vtt Decoupling

      13
    • 2.2.3 FSB Decoupling

      13
  • 2.3 Voltage Identification

    14
  • 2.4 Reserved, Unused, and TESTHI Signals

    16
  • 2.5 Flexible Motherboard Guidelines (FMB)

    16
  • 2.6 Power Segment Identifier (PSID)

    17
  • 2.7 Voltage and Current Specification

    17
    • 2.7.1 Absolute Maximum and Minimum Ratings

      17
    • 2.7.2 DC Voltage and Current Specification

      18
    • 2.7.3 VCC Overshoot

      21
    • 2.7.4 Die Voltage Validation

      22
  • 2.8 Signaling Specifications

    22
    • 2.8.1 FSB Signal Groups

      22
    • 2.8.2 CMOS and Open Drain Signals

      24
    • 2.8.3 Processor DC Specifications

      24
      • 2.8.3.1 Platform Environment Control Interface (PECI) DC Specifications

        26
      • 2.8.3.2 GTL+ Front Side Bus Specifications

        26
  • 2.9 Clock Specifications

    28
    • 2.9.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking

      28
    • 2.9.2 FSB Frequency Select Signals (BSEL[2:0])

      28
    • 2.9.3 Phase Lock Loop (PLL) and Filter

      29
    • 2.9.4 BCLK[1:0] Specifications

      30
• 3 Package Mechanical Specifications

  33
  • 3.1 Package Mechanical Specifications

    33
    • 3.1.1 Package Mechanical Drawing

      34
    • 3.1.2 Processor Component Keep-Out Zones

      38
    • 3.1.3 Package Loading Specifications

      38
    • 3.1.4 Package Handling Guidelines

      38
    • 3.1.5 Package Insertion Specifications

      39
    • 3.1.6 Processor Mass Specification

      39
    • 3.1.7 Processor Materials

      39
    • 3.1.8 Processor Markings

      39
    • 3.1.9 Processor Land Coordinates

      40
• 4 Land Listing and Signal Descriptions

  41
  • 4.1 Processor Land Assignments

    41
  • 4.2 Alphabetical Signals Reference

    64
• 5 Thermal Specifications and Design Considerations

  75
  • 5.1 Processor Thermal Specifications

    75
    • 5.1.1 Thermal Specifications

      75
    • 5.1.2 Thermal Metrology

      80
  • 5.2 Processor Thermal Features

    80
    • 5.2.1 Thermal Monitor

      80
    • 5.2.2 Thermal Monitor 2

      81
    • 5.2.3 On-Demand Mode

      82
    • 5.2.4 PROCHOT# Signal

      83
    • 5.2.5 THERMTRIP# Signal

      83
  • 5.3 Platform Environment Control Interface (PECI)

    83
    • 5.3.1 Introduction

      83
      • 5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems

        84
    • 5.3.2 PECI Specifications

      84
      • 5.3.2.1 PECI Device Address

        84
      • 5.3.2.2 PECI Command Support

        84
      • 5.3.2.3 PECI Fault Handling Requirements

        84
      • 5.3.2.4 PECI GetTemp0() Error Code Support

        85
• 6 Features

  87
  • 6.1 Power-On Configuration Options

    87
  • 6.2 Clock Control and Low Power States

    87
    • 6.2.1 Normal State

      88
    • 6.2.2 HALT and Extended HALT Powerdown States

      88
      • 6.2.2.1 HALT Powerdown State

        88
      • 6.2.2.2 Extended HALT Powerdown State

        89
    • 6.2.3 Stop Grant State

      89
    • 6.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State

      89
      • 6.2.4.1 HALT Snoop State, Stop Grant Snoop State

        90
      • 6.2.4.2 Extended HALT Snoop State

        90
    • 6.2.5 Enhanced Intel SpeedStep® Technology

      90
    • 6.2.6 Processor Power Status Indicator (PSI) Signal

      90
• 7 Boxed Processor Specifications

  91
  • 7.1 Introduction

    91
  • 7.2 Mechanical Specifications

    92
    • 7.2.1 Boxed Processor Cooling Solution Dimensions

      92
    • 7.2.2 Boxed Processor Fan Heatsink Weight

      94
    • 7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      94
  • 7.3 Electrical Requirements

    94
    • 7.3.1 Fan Heatsink Power Supply

      94
  • 7.4 Thermal Specifications

    96
    • 7.4.1 Boxed Processor Cooling Requirements

      96
    • 7.4.2 Variable Speed Fan

      98
• 8 Debug Tools Specifications

  101
  • 8.1 Logic Analyzer Interface (LAI)

    101
    • 8.1.1 Mechanical Considerations

      101
    • 8.1.2 Electrical Considerations

      101