用户手册目录Chapter I: Functional Features4Chapter III: Hardware Layout and Interface Specification6Chapter IV: Application Specification84.1 Module application circuit84.2 Precautions on module usage9Chapter V: Functional Specification105.1 Networking function105.2 Serial port framing mechanism105.3 Transparent transmission mode115.4 Command mode115.5 Echo mode115.6 Serial port upgrade mode115.7 Low power mode115.9 Service specification135.10 Serial frame structure135.11 Serial command overview14Chapter VI Work Instruction of Reflow Soldering17Notes to Users:18文件大小： 525.3 KB页数： 17Language: English打开用户手册
