用户手册目录Preface5Introduction5Document Layout5Conventions Used in this Guide6Recommended Reading7The Microchip Web Site7Customer Support7Document Revision History7Chapter 1. Product Overview91.1 Introduction91.2 MCP16323 Short Overview91.3 What is the MCP16323 Evaluation Board?101.4 MCP16323 Evaluation Board Kit Contents10Chapter 2. Installation and Operation112.1 Introduction112.2 Getting Started12Appendix A. Schematic and Layouts13A.1 Introduction13A.2 Board – Schematic14A.3 Board – Top Layer15A.4 Board – Top Copper15A.5 Board – Bottom Copper16Appendix B. Bill of Materials17Corporate Office18Atlanta18Boston18Chicago18Cleveland18Fax: 216-447-064318Dallas18Detroit18Indianapolis18Toronto18Fax: 852-2401-343118Australia - Sydney18China - Beijing18China - Shanghai18India - Bangalore18Korea - Daegu18Korea - Seoul18Singapore18Taiwan - Taipei18Fax: 43-7242-2244-39318Denmark - Copenhagen18France - Paris18Germany - Munich18Italy - Milan18Spain - Madrid18UK - Wokingham18Worldwide Sales and Service18文件大小： 218.7 KB页数： 18Language: English打开用户手册
数据表目录18V Input, 3A Output, High Efficiency Synchronous Buck Regulator with Power Good Indication11.0 Electrical Characteristics3TABLE 1-1: Temperature Characteristics52.0 Typical Performance Curves7FIGURE 2-1: 5V VOUT Efficiency vs. IOUT.7FIGURE 2-2: 3.3V VOUT Efficiency vs. IOUT.7FIGURE 2-3: 2.5V VOUT Efficiency vs. IOUT.7FIGURE 2-4: 1.8V VOUT Efficiency vs. IOUT.7FIGURE 2-5: 1.5V VOUT Efficiency vs. IOUT.7FIGURE 2-6: 0.9V VOUT Efficiency vs. IOUT.7FIGURE 2-7: 5V VOUT vs. IOUT.8FIGURE 2-8: 3.3V VOUT vs. IOUT.8FIGURE 2-9: 2.5V VOUT vs. IOUT.8FIGURE 2-10: 1.8V VOUT vs. IOUT.8FIGURE 2-11: 1.5V VOUT vs. IOUT.8FIGURE 2-12: 0.9V VOUT vs. IOUT.8FIGURE 2-13: 5V VOUT vs. VIN.9FIGURE 2-14: 3.3V VOUT vs. VIN.9FIGURE 2-15: 2.5V VOUT vs. VIN.9FIGURE 2-16: 1.8V VOUT vs. VIN.9FIGURE 2-17: 1.5V VOUT vs. VIN.9FIGURE 2-18: 0.9V VOUT vs. VIN.9FIGURE 2-19: Shutdown Current vs. Input Voltage.10FIGURE 2-20: Shutdown Current vs. Temperature.10FIGURE 2-21: Output Voltage vs. Temperature.10FIGURE 2-22: Oscillator Frequency vs. Temperature (IOUT = 300 mA).10FIGURE 2-23: Input Quiescent Current vs. Temperature (No Load, Switching).10FIGURE 2-24: Input Current vs. Temperature (No Load, No Switching).10FIGURE 2-25: Maximum VIN to VOUT Ratio for Continuous Switching.11FIGURE 2-26: Light Load Switching Waveforms.11FIGURE 2-27: Heavy Load Switching Waveforms.11FIGURE 2-28: Startup From Enable.11FIGURE 2-29: Startup From VIN.11FIGURE 2-30: Load Transient Response.11FIGURE 2-31: Line Transient Response.123.0 Pin Descriptions13TABLE 3-1: Pin Function Table133.1 Switch Pin (SW)133.2 Power Supply Input Voltage Pin (VIN)133.3 Signal Ground Pin (SGND)133.4 Feedback Voltage Pin (VFB)133.5 Power Good Pin (PG)133.6 Enable Pin (EN)143.7 BOOST Pin (BOOST)143.8 Power Ground Pin (PGND)143.9 Exposed Thermal Pad (EP)144.0 Detailed Description154.1 Device Overview15FIGURE 4-1: MCP16323 Block Diagram.164.2 Functional Description17FIGURE 4-2: Synchronous Step-Down Converter.175.0 Application Information19TABLE 5-1: Capacitor Value Range19TABLE 5-2: MCP16323 RECOMMENDED INDUCTORS20FIGURE 5-1: Recommended Layout.21FIGURE 5-2: Recommended Layout – Schematic.22TABLE 5-3: Recommended Layout Components226.0 Packaging Information236.1 Package Marking Information23Appendix A: Revision History27Revision A (December 2011)27Product Identification System29Trademarks31Worldwide Sales and Service32文件大小： 1.0 MB页数： 32Language: English打开用户手册
