数据表目录1.0 Electrical Characteristics31.1 Maximum Ratings*3FIGURE 1-1: Serial Timing.6FIGURE 1-2: Power-up Timing.62.0 Typical Performance Curves7FIGURE 2-1: INL Error vs. Input Voltage (VDD = 2.7V).7FIGURE 2-2: INL Error vs. Input Voltage (VDD = 5.0V).7FIGURE 2-3: INL Error vs. Input Voltage (VDD = 5.0V, VREF = 5V).7FIGURE 2-4: Maximum INL Error vs. VREF.7FIGURE 2-5: Maximum INL Error vs. Temperature.7FIGURE 2-6: Output Noise vs. Input Voltage (VDD = 2.7V).7FIGURE 2-7: Output Noise vs. Input Voltage (VDD = 5.0V).8FIGURE 2-8: Output Noise vs. VREF.8FIGURE 2-9: Output Noise vs.VDD.8FIGURE 2-10: Output Noise vs. Temperature.8FIGURE 2-11: Offset Error vs VDD (VCM = 0V).8FIGURE 2-12: Offset Error vs. Temperature (VREF = 5.0V).8FIGURE 2-13: Full Scale Error vs. VDD.9FIGURE 2-14: Full Scale Error vs. Temperature.9FIGURE 2-15: Full Scale Error vs. Temperature (VREF = 5.0V).9FIGURE 2-16: MCP3550/1 Output Noise Histogram.9FIGURE 2-17: MCP3553 Output Noise Histogram.9FIGURE 2-18: Total Unadjusted Error (TUE) vs. Input Voltage (VDD = 2.7V).9FIGURE 2-19: Total Unadjusted Error (TUE) vs. Input Voltage.10FIGURE 2-20: Total Unadjusted Error (TUE) vs. Input Voltage (VREF = 5.0V).10FIGURE 2-21: Maximum TUE vs. VREF.10FIGURE 2-22: Maximum TUE vs. Temperature.10FIGURE 2-23: Maximum TUE vs. VDD.10FIGURE 2-24: IDDS vs. Temperature.10FIGURE 2-25: IDD vs. VDD.11FIGURE 2-26: IDD vs. Temperature.113.0 Pin Descriptions13TABLE 3-1: Pin Function Table133.1 Voltage Reference (VREF)133.2 Analog Inputs (VIN+, VIN-)133.3 Supply Voltage (VDD, VSS)133.4 Serial Clock (SCK)133.5 Data Output (SDO/RDY)133.6 Chip Select (CS)144.0 Device Overview15FIGURE 4-1: MCP3550/1/3 Functional Block Diagram.154.1 MCP3550/1/3 Delta-Sigma Modulator with Internal Offset and Gain Calibration164.2 Digital Filter16TABLE 4-1: data rate, output noise and Digital filter specificaTIons by device16FIGURE 4-2: SINC Filter Response, MCP3550-50 Device.17FIGURE 4-3: SINC Filter Response, MCP3550-60 Device.17FIGURE 4-4: SINC Filter Response, MCP3551 Device, Simultaneous 50/60 Hz Rejection.17FIGURE 4-5: SINC Filter Response at Integer Multiples of the Sampling Frequency (fs).174.3 Internal Oscillator174.4 Differential Analog Inputs184.5 Voltage Reference Input Pin184.6 Power-On Reset (POR)18FIGURE 4-6: Power-On Reset Operation.194.7 Shutdown Mode194.8 Sleep Mode195.0 Serial Interface215.1 Overview21FIGURE 5-1: Typical Serial Device Communication and Example Digital Output Codes for Specific Analog Input Voltages.215.2 Controlling Internal Conversions and the Internal Oscillator22FIGURE 5-2: Single Conversion Mode.22FIGURE 5-3: Continuous Conversion Mode.225.3 Single Conversion Mode23FIGURE 5-4: RDY Functionality in Single Conversion Mode.235.4 Continuous Conversion Mode23FIGURE 5-5: Most Current Continuous Conversion Mode Data.235.5 Using The MCP3550/1/3 with Microcontroller (MCU) SPI Ports25FIGURE 5-6: SPI Communication – Mode 1,1.25FIGURE 5-7: SPI Communication – Mode 0,0.256.0 Packaging Information276.1 Package Marking Information27文件大小： 857.8 KB页数： 36Language: English打开用户手册
用户手册目录Preface5Introduction5Document Layout5Conventions Used in this Guide6Recommended Reading6The Microchip Web Site7Customer Support7Document Revision History7Chapter 1. Product Overview91.1 Introduction91.2 What is the MCP355X Sensor Application Developer’s Board?91.3 What the MCP355X Sensor Application Developer’s Board Kit Includes10Chapter 2. Hardware Description112.1 Overview112.2 Sensor Input Connections122.3 Channel 1 - Low-Cost Differential Gain Circuit Using MCP6XX Amplifier132.4 Channel 2 - High-Precision Gain Circuit152.5 Bridge Simulator Boards16Chapter 3. Firmware Description173.1 Firmware Overview173.2 PIC16F877173.3 PIC18F455020Chapter 4. DataView214.1 Overview214.2 Scope Plot Window214.3 Noise Histogram Window224.4 Auxiliary Data Window224.5 Configuring DataView23Appendix A. Schematic and Layouts25A.1 Introduction25A.2 Schematic - Page 126A.3 Schematic - Page 227A.4 Schematic - Page 328A.5 Schematic - Bridge Simulator29A.6 Board Layout - Top LAyer and Silk Screen30A.7 Board Layout - Top LAyer30A.8 Board Layout - Bottom Layer And Silk Screen31A.9 Board Layout - Bottom LAyer31A.10 Board Layout - Bridge Simulator32Appendix B. Bill Of Materials (BOM)33Worldwide Sales and Service36文件大小： 1.9 MB页数： 36Language: English打开用户手册
