数据表目录Preface5Introduction5Document Layout5Conventions Used in this Guide6Recommended Reading6The Microchip Web Site7Customer Support7Document Revision History7Chapter 1. Product Overview91.1 Introduction91.2 What is the MCP7386X Battery Charger Evaluation Board?91.3 What the MCP7386X Battery Charger Evaluation Board Includes9Chapter 2. Installation and Operation112.1 Features112.2 Getting Started112.3 Detailed Description12Appendix A. Schematic and Layouts15A.1 Introduction15A.2 Board SchemAtic16A.3 Board – Top Layer17A.4 Board – Silk screen Layer18A.5 Board – Bottom Layer19Appendix B. Bill Of Materials (BOM)21Worldwide Sales and Service22文件大小： 454.3 KB页数： 22Language: English打开用户手册
数据表目录1.0 Electrical Characteristics42.0 Typical Performance Curves7FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Charge Current (IOUT).7FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD).7FIGURE 2-3: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD).7FIGURE 2-4: Supply Current (ISS) vs. Charge Current (IOUT).7FIGURE 2-5: Supply Current (ISS) vs. Supply Voltage (VDD).7FIGURE 2-6: Supply Current (ISS) vs. Supply Voltage (VDD).7FIGURE 2-7: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT).8FIGURE 2-8: Thermistor Reference Voltage (VTHREF) vs. Supply Voltage (VDD).8FIGURE 2-9: Thermistor Reference Voltage (VTHREF) vs. Thermistor Bias Current (ITHREF).8FIGURE 2-10: Supply Current (ISS) vs. Ambient Temperature (TA).8FIGURE 2-11: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA).8FIGURE 2-12: Thermistor Reference Voltage (VTHREF) vs. Ambient Temperature (TA).8FIGURE 2-13: Battery Regulation Voltage (VBAT) vs. Charge Current (IOUT).9FIGURE 2-14: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD).9FIGURE 2-15: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD).9FIGURE 2-16: Supply Current (ISS) vs. Charge Current (IOUT).9FIGURE 2-17: Supply Current (ISS) vs. Supply Voltage (VDD).9FIGURE 2-18: Supply Current (ISS) vs. Supply Voltage (VDD).9FIGURE 2-19: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT).10FIGURE 2-20: Thermistor Reference Voltage (VTHREF) vs. Supply Voltage (VDD).10FIGURE 2-21: Thermistor Reference Voltage (VTHREF) vs. Thermistor Bias Current (ITHREF).10FIGURE 2-22: Supply Current (ISS) vs. Ambient Temperature (TA).10FIGURE 2-23: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA).10FIGURE 2-24: Thermistor Reference Voltage (VTHREF) vs. Ambient Temperature (TA).10FIGURE 2-25: Line Transient Response.11FIGURE 2-26: Load Transient Response.11FIGURE 2-27: Power Supply Ripple Rejection.11FIGURE 2-28: Line Transient Response.11FIGURE 2-29: Load Transient Response.11FIGURE 2-30: Power Supply Ripple Rejection.11FIGURE 2-31: Charge Current (IOUT) vs. Programming Resistor (RPROG).12FIGURE 2-32: Charge Current (IOUT) vs. Ambient Temperature (TA).123.0 Pin Description13TABLE 3-1: Pin Function Table133.1 Voltage Regulation Selection (VSET)133.2 Battery Management Input Supply (VDD2, VDD1)133.3 Battery Management 0V Reference (VSS1, VSS2, VSS3)133.4 Current Regulation Set (PROG)133.5 Cell Temperature Sensor Bias (THREF)133.6 Cell Temperature Sensor Input (THERM)133.7 Timer Set133.8 Battery Charge Control Output (VBAT1, VBAT2)133.9 Battery Voltage Sense (VBAT3)133.10 Logic Enable (EN)143.11 Fault Status Output (STAT2)143.12 Charge Status Output (STAT1)143.13 Exposed Pad (EP)144.0 Device Overview154.1 Charge Qualification and Preconditioning154.2 Constant Current Regulation – Fast Charge154.3 Constant Voltage Regulation154.4 Charge Cycle Completion and Automatic Re-Charge154.5 Thermal Regulation15FIGURE 4-1: Typical Maximum Charge Current vs. Die Temperature.154.6 Thermal Shutdown15FIGURE 4-2: Operational Flow Algorithm.165.0 Detailed Description175.1 Analog Circuitry175.2 Digital Circuitry18TABLE 5-1: Status Outputs186.0 Applications19FIGURE 6-1: Typical Application Circuit.19FIGURE 6-2: Typical Charge Profile.19FIGURE 6-3: Typical Charge Profile in Thermal Regulation.206.1 Application Circuit Design206.2 PCB Layout Issues217.0 Packaging Information237.1 Package Marking Information23Appendix A: Revision History29Product ID System31Trademarks33Worldwide Sales34文件大小： 844.7 KB页数： 34Language: English打开用户手册
