用户手册目录1. General description12. Features13. Applications14. Ordering information25. Block diagram26. Pinning information36.1 Pinning36.2 Pin description37. Limiting values48. Static characteristics59. Dynamic characteristics610. Typical performance curves711. Application information1611.1 Power supply decoupling considerations1611.2 Input capacitor selection1611.3 PCB layout considerations1711.4 Filter-free operation and ferrite bead filters1711.5 Efficiency and thermal considerations1811.6 Additional thermal information1812. Test information1813. Package outline1914. Soldering of SMD packages2014.1 Introduction to soldering2014.2 Wave and reflow soldering2014.3 Wave soldering2014.4 Reflow soldering2115. Abbreviations2216. Revision history2217. Legal information2317.1 Data sheet status2317.2 Definitions2317.3 Disclaimers2317.4 Trademarks2318. Contact information2319. Contents24文件大小： 171.8 KB页数： 24Language: English打开用户手册
用户手册目录1. General description12. Features13. Applications14. Ordering information25. Block diagram26. Pinning information36.1 Pinning36.2 Pin description37. Limiting values48. Static characteristics59. Dynamic characteristics610. Typical performance curves711. Application information1611.1 Power supply decoupling considerations1611.2 Input capacitor selection1611.3 PCB layout considerations1711.4 Filter-free operation and ferrite bead filters1711.5 Efficiency and thermal considerations1811.6 Additional thermal information1812. Test information1813. Package outline1914. Soldering of SMD packages2014.1 Introduction to soldering2014.2 Wave and reflow soldering2014.3 Wave soldering2014.4 Reflow soldering2115. Abbreviations2216. Revision history2217. Legal information2317.1 Data sheet status2317.2 Definitions2317.3 Disclaimers2317.4 Trademarks2318. Contact information2319. Contents24文件大小： 171.8 KB页数： 24Language: English打开用户手册
