用户手册目录1. General description12. Features13. Applications14. Quick reference data15. Ordering information26. Block diagram27. Pinning information37.1 Pinning37.2 Pin description38. Functional description48.1 Input configuration48.2 Power amplifier58.2.1 Output power measurement58.2.2 Headroom58.3 Mode selection58.3.1 Switch-on and switch-off68.4 Supply Voltage Ripple Rejection (SVRR)68.5 Built-in protection circuits68.5.1 Short-circuit protection68.5.2 Thermal shutdown protection69. Limiting values710. Thermal characteristics711. Static characteristics712. Dynamic characteristics813. Internal circuitry1314. Application information1414.1 Printed-circuit board (PCB)1414.1.1 Layout and grounding1414.1.2 Power supply decoupling1514.2 Thermal behaviour and heatsink calculation1615. Test information1615.1 Quality information1615.2 Test conditions1616. Package outline17SOT243-11717. Soldering1817.1 Introduction to soldering through-hole mount packages1817.2 Soldering by dipping or by solder wave1817.3 Manual soldering1817.4 Package related soldering information1818. Revision history1919. Data sheet status2120. Definitions2121. Disclaimers21文件大小： 398.5 KB页数： 23Language: English打开用户手册
用户手册目录1. General description12. Features13. Applications14. Quick reference data15. Ordering information26. Block diagram27. Pinning information37.1 Pinning37.2 Pin description38. Functional description48.1 Input configuration48.2 Power amplifier58.2.1 Output power measurement58.2.2 Headroom58.3 Mode selection58.3.1 Switch-on and switch-off68.4 Supply Voltage Ripple Rejection (SVRR)68.5 Built-in protection circuits68.5.1 Short-circuit protection68.5.2 Thermal shutdown protection69. Limiting values710. Thermal characteristics711. Static characteristics712. Dynamic characteristics813. Internal circuitry1314. Application information1414.1 Printed-circuit board (PCB)1414.1.1 Layout and grounding1414.1.2 Power supply decoupling1514.2 Thermal behaviour and heatsink calculation1615. Test information1615.1 Quality information1615.2 Test conditions1616. Package outline17SOT243-11717. Soldering1817.1 Introduction to soldering through-hole mount packages1817.2 Soldering by dipping or by solder wave1817.3 Manual soldering1817.4 Package related soldering information1818. Revision history1919. Data sheet status2120. Definitions2121. Disclaimers21文件大小： 398.5 KB页数： 23Language: English打开用户手册
