用户手册目录1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information37.1 Pinning37.2 Pin description48. Functional description48.1 Input configuration48.2 Power amplifier48.2.1 Output power measurement48.2.2 Headroom58.3 Mode selection58.4 Supply voltage ripple rejection58.5 Built-in protection circuits69. Limiting values610. Thermal characteristics611. Static characteristics712. Dynamic characteristics713. Application information1013.1 Application diagrams1013.1.1 Single-ended application1013.1.2 Volume control drive options1113.2 Printed-circuit board1213.2.1 Layout and grounding1213.2.2 Power supply decoupling1213.3 Thermal behavior and heatsink calculation1314. Test information1414.1 Quality information1415. Package outline1516. Soldering1616.1 Introduction to soldering through-hole mount packages1616.2 Soldering by dipping or by solder wave1616.3 Manual soldering1616.4 Package related soldering information1617. Revision history1718. Legal information1818.1 Data sheet status1818.2 Definitions1818.3 Disclaimers1818.4 Trademarks1819. Contact information1820. Contents19文件大小： 124.3 KB页数： 19Language: English打开用户手册
用户手册目录1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information37.1 Pinning37.2 Pin description48. Functional description48.1 Input configuration48.2 Power amplifier48.2.1 Output power measurement48.2.2 Headroom58.3 Mode selection58.4 Supply voltage ripple rejection58.5 Built-in protection circuits69. Limiting values610. Thermal characteristics611. Static characteristics712. Dynamic characteristics713. Application information1013.1 Application diagrams1013.1.1 Single-ended application1013.1.2 Volume control drive options1113.2 Printed-circuit board1213.2.1 Layout and grounding1213.2.2 Power supply decoupling1213.3 Thermal behavior and heatsink calculation1314. Test information1414.1 Quality information1415. Package outline1516. Soldering1616.1 Introduction to soldering through-hole mount packages1616.2 Soldering by dipping or by solder wave1616.3 Manual soldering1616.4 Package related soldering information1617. Revision history1718. Legal information1818.1 Data sheet status1818.2 Definitions1818.3 Disclaimers1818.4 Trademarks1819. Contact information1820. Contents19文件大小： 124.3 KB页数： 19Language: English打开用户手册
