Intel D525 AU80610006225AA User Manual

Product codes
AU80610006225AA
Page of 79
Datasheet
13
Introduction 
1.7
References
Material and concepts available in the following documents may be beneficial when 
reading this document:
Storage Conditions
A non-operational state. The processor may be installed in a platform, 
in a tray, or loose. Processors may be sealed in packaging or exposed 
to free air. Under these conditions, processor landings should not be 
connected to any supply voltages, have any I/Os biased or receive any 
clocks. Upon exposure to “free air” (i.e., unsealed packaging or a 
device removed from packaging material) the processor must be 
handled in accordance with moisture sensitivity labeling (MSL) as 
indicated on the packaging material.
TAC
Thermal Averaging Constant
TDP
Thermal Design Power
TOM
Top of Memory
TTM
Time-To-Market
V
CC
Processor core power supply
V
SS
Processor ground
V
CCGFX
Graphics core power supply
V_SM
DDR2 power rail
VLD
Variable Length Decoding
Term
Description
Table 1-1. References
Document
Document 
Number
Intel® 64 and IA-32 Architectures Software Developer's Manuals
Volume 1: Basic Architecture 
http://
www.intel.com/
products/processor/
manuals/index.htm
Volume 2A: Instruction Set Reference, A-M
Volume 2B: Instruction Set Reference, N-Z
Volume 3A: System Programming Guide
Volume 3B: System Programming Guide
Intel® Atom™ Processor D500 Specification Update
322862-002
Intel® Atom™ Processor D400 Specification Update
322861-002
Intel® Atom™ Processor D400 and D500 Series Thermal Mechanical Design 
Guidelines
322856-002
Intel® NM10 Express Chipset Datasheet
322896-001
Intel® NM10 Express Chipset Specification Update
322897-001