Intel D2550MUD2 BOXD2550MUD2 User Manual
Product codes
BOXD2550MUD2
Intel Desktop Board D2550MUD2 Technical Product Specification
60
Table 29. Thermal Considerations for Components
Component
Maximum Case Temperature
Intel Atom processor
100
o
C
Processor voltage regulator area
85
o
C
Intel NM10 Express Chipset
113
o
C
Memory SO-DIMM
85
o
C
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 16
2.6.1
Passive Heatsink Design in a Passive System
Environment
This section highlights important guidelines and related thermal boundary conditions
for passive heatsink design in a passive system environment. Passive heatsink
describes a thermal solution without a fan attached. Passive system environment
describes a chassis with either a power supply fan or a built-in system fan.
This information should be used in conjunction with the Thermal and Mechanical
This information should be used in conjunction with the Thermal and Mechanical
Design Guide (TMDG) published for the Intel Atom processor D2000 series. The TMDG
contains detailed package information and thermal mechanical specifications for the
processors. The TMDG also contains information on how to enable a completely fanless
design provided the right usage scenario and boundary conditions are observed for
optimal thermal design. While the TMSDG has a section on thermal design for passive
system environments (page 32), the information in this section can also be used to
complement the TMDG.
2.6.1.1
Definition of Terms
Term
Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink.
T
J
Processor junction temperature.
Ψ
JA
Junction-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
performance using total package power. Defined as (T
J
- T
A
)/TDP.
Note: Heat source must be specified for
Ψ measurements.
TIM
Thermal Interface Material: the thermally conductive compound between the heatsink and the
processor die surface. This material fills the air gaps and voids, and enhances the transfer of the heat
from the processor die surface to the heatsink.
processor die surface. This material fills the air gaps and voids, and enhances the transfer of the heat
from the processor die surface to the heatsink.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications. Thermal
solutions should be designed to dissipate the thermal design power.
solutions should be designed to dissipate the thermal design power.
T
A
external
The measured external ambient temperature surrounding the chassis. The external ambient
temperature should be measured just upstream of the chassis inlet vent.
temperature should be measured just upstream of the chassis inlet vent.