Intel Pentium D 830 HH80551PG0802MN Data Sheet

Product codes
HH80551PG0802MN
Page of 106
82
 Datasheet
 
Thermal Specifications and Design Considerations
5.2.5
THERMTRIP# Signal
Regardless of whether or not the Thermal Monitor feature is enabled, in the event of a catastrophic 
cooling failure, the processor will automatically shut down when the silicon has reached an 
elevated temperature (refer to the THERMTRIP# definition in 
). At this point, the FSB 
signal THERMTRIP# will go active and stay active as described in 
activation is independent of processor activity and does not generate any bus cycles. 
5.2.6
T
CONTROL
 and Fan Speed Reduction
T
CONTROL
 is a temperature specification based on a temperature reading from the thermal diode. 
The value for T
CONTROL
 will be calibrated in manufacturing and configured for each processor. 
When T
DIODE
 is above T
CONTROL
, then T
C
 must be at or below T
C-MAX
 as defined by the thermal 
profile in 
and 
; otherwise, the processor temperature can be maintained at 
T
CONTROL
 (or lower) as measured by the thermal diode.
The purpose of this feature is to support acoustic optimization through fan speed control.
5.2.7
Thermal Diode
The processor incorporates an on-die thermal diode. A thermal sensor located on the system board 
may monitor the die temperature of the processor for thermal management/long term die 
temperature change purposes. 
 provide the diode parameter and interface 
specifications. This thermal diode is separate from the Thermal Monitor’s thermal sensor and 
cannot be used to predict the behavior of the Thermal Monitor.
Table 5-4. Thermal Diode Parameters
Symbol
Parameter
Min
Typ
Max
Unit
Notes
I
FW
Forward Bias Current
11
187
µA
1
NOTES:
1.
Intel does not support or recommend operation of the thermal diode under reverse bias.
n
Diode Ideality Factor
1.0083
1.011
1.023
2, 3, 4, 5
2.
Characterized at 75 °C.
3.
Not 100% tested. Specified by design characterization.
4.
The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode equation:
I
FW
 = I
S
 * (e 
qV
D
/nkT
 –1)
where I
S
 = saturation current, q = electronic charge, V
D
 = voltage across the diode, k = Boltzmann 
Constant, and T = absolute temperature (Kelvin).
5.
Devices found to have an ideality factor of 1.0183 to 1.023 will create a temperature error approximately 2 °C higher than
the actual temperature. To minimize any potential acoustic impact of this temperature error, T
CONTROL
 will be increased
by 2 °C on these parts.
R
T
Series Resistance
3.242
3.33
3.594
Ω
6.
The series resistance, R
T
, is provided to allow for a more accurate measurement of the thermal diode temperature. R
T
,
as defined, includes the pins of the processor but does not include any socket resistance or board trace resistance be-
tween the socket and the external remote diode thermal sensor. RT can be used by remote diode thermal sensors with
automatic series resistance cancellation to calibrate out this error term. Another application is that a temperature offset
can be manually calculated and programmed into an offset register in the remote diode thermal sensors as exemplified
by the equation:
T
error
 = [R
T
 * (N-1) * I
FWmin
] / [nk/q * ln N]
where T
error
 = sensor temperature error, N = sensor current ratio, k = Boltzmann Constant, q = electronic 
charge.