Atmel Evaluation Kit AT91SAM9M10-G45-EK AT91SAM9M10-G45-EK Data Sheet
Product codes
AT91SAM9M10-G45-EK
51
SAM9M10 [SUMMARY]
6355ES–ATARM–12-Mar-13
This package respects the recommendations of the NEMI User Group.
11.2
Soldering Profile
gives the recommended soldering profile from J-STD-020C.
Note:
It is recommended to apply a soldering temperature higher than 250°C
A maximum of three reflow passes is allowed per component.
Table 11-1. Soldering Information
Ball Land
0.4 mm +/- 0.05
Soldering Mask Opening
0.275 mm +/- 0.03
Table 11-2. Device and 324-ball TFBGA Package Maximum Weight
400
mg
Table 11-3. 324-ball TFBGA Package Characteristics
Moisture Sensitivity Level
3
Table 11-4. Package Reference
JEDEC Drawing Reference
MO-210
JESD97 Classification
e1
Table 11-5. Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3
°C/sec. max.
Preheat Temperature 175°C
±
25°C
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
Time within 5
°C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260 +0
°C
Ramp-down Rate
6
°C/sec. max.
Time 25
°C to Peak Temperature
8 min. max.