These specifications define the operating thermal limits of the SoC. Thermal solutions
not designed to provide the following level of thermal capability may affect the long-
term reliability of the processor and system, but more likely result in performance
throttling to ensure silicon junction temperatures within spec. For more details on
thermal solution design, refer to this product's Thermal/Mechanical Design Guide.

This section specifies the thermal specifications for all SKUs. Some definitions are
needed, however. “Tj Max” defines the maximum operating silicon junction
temperature. Unless otherwise specified, all specifications in this document assume Tj
Max as the worse case junction temperature. This is the temperature needed to ensure
TDP specifications when running at guaranteed CPU and graphics frequencies. “TDP”
defines the thermal dissipated power for a worse case estimated real world thermal
scenario.

Table 63. Intel

Atom™ Processor E3800 Product Family Thermal Specifications

SKU

Min/Max

TDP

E3845

-40 to 110 °C

10 W @ Tj Max

E3827

-40 to 110 °C

8 W @ Tj Max

E3826

-40 to 110 °C

7 W @ Tj Max

E3825

-40 to 110 °C

6 W @ Tj Max

E3815

-40 to 110 °C

5 W @ Tj Max

E3805

-40 to 110 °C

3 W @ Tj Max