Symbol MC70 User Manual

Page of 166
A - 2
MC70 User Guide
Operating System
Microsoft
®
 Windows Mobile™ 2005
Memory
64MB RAM/128MB ROM
Interface/Communications
RS-232, USB 1.1
User Environment
Operating Temperature
14°F to 155°F / -10°C to 68°C 
Storage Temperature
-40° F to 140° F / -40° C to 60° C
Charging Temperature
32°F to 104°F / 0° C to 40° C
Humidity
95% non-condensing
Drop Specification
4 ft. drop to concrete, 6 drops per 6 sides over operating temperature range; 
5 ft. drop to concrete, 2 drops per 6 sides at ambient temperature 73° F/23° C
Electrostatic Discharge (ESD)
+/-15kVdc air discharge, +/-8kVdc direct discharge, +/-8kVdc indirect discharge 
Sealing
IP54
Wireless WAN Data and Voice Communications
Wireless Wide Area (WWAN) radio
eGPRS/GSM (850, 900, 1800 and 1900 MHz)
Wireless LAN Data and Voice Communications
Wireless Local Area (WLAN) radio
Tri-mode IEEE
®
 802.11a/b/g
Data Rates Supported
1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, and 54 Mbps
Operating Channels
Chan 8-169 (5040 – 5845 MHz) (4920 – 4980 MHz) Japan only 
Chan 1-13 (2412-2472 MHz) Chan 14 (2484 MHz) Japan only 
Actual operating frequencies depend on regulatory rules and certification agency
Security
WPA, WEP (40 or 128 bit), TKIP, TLS, TTLS (MS-CHAP), TTLS (MS-CHAP v2), TTLS 
(CHAP), TTLS-MD5, TTLS-PAP, PEAP-TLS, PEAP (MS-CHAP v2), AES, LEAP
Spreading Technique
Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency Division 
Multiplexing (OFDM)
Antenna
Internal for LAN, External for WAN
Voice Communication
Integrated Voice-over-IP ready (P2P, PBX, PTT), Wi-Fi™-certified, IEEE 802.11a/b/g direct 
sequence wireless LAN
Wireless PAN Data and Voice Communications
Bluetooth
Class II, v 1.2
Data Capture Specifications
Options
2D imager, 1D linear
Table A-1    
EDA Technical Specifications (Continued)
Item
Description