APC PDPM175G6H User Manual
150/175kw Modular PDU Installation
6
Perform Equipotential Bonding
Proper bonding is essential to create an equipotential plane
between service grounds and equipment during fault and
transient conditions.
Connect the two equipotential bonding conductors between
adjacent enclosures in the system. The bonding conductors are
pre-connected to the PDU. The M8 nuts and washers are
supplied in the accessory kit. Move the equipotential
between service grounds and equipment during fault and
transient conditions.
Connect the two equipotential bonding conductors between
adjacent enclosures in the system. The bonding conductors are
pre-connected to the PDU. The M8 nuts and washers are
supplied in the accessory kit. Move the equipotential
bonding
wires to fit your system configuration.
Connect and Level Enclosures
The equipment must be installed on a level floor. The
leveling feet will stabilize the enclosure, but will not account
for a badly sloped floor. If the PDU is on a raised-tile floor,
verify that it is properly aligned with the tiles.
leveling feet will stabilize the enclosure, but will not account
for a badly sloped floor. If the PDU is on a raised-tile floor,
verify that it is properly aligned with the tiles.
1. Align the enclosures.
2. Use a screwdriver to lower the four leveling
feet.
3. Use a 13/17 mm wrench to adjust the leveling
feet. Do not move the enclosure after the
leveling feet have been lowered.
leveling feet have been lowered.
4. Turn the joining brackets and secure with a
screw to connect the enclosures.
pd
x
0
85
0
a
pd
x
0
852
a
p
d
x
085
1a