AMD 1207 Manuale Utente

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Chapter 4
Thermal Design of Custom 1U-2P Systems
25
Thermal Design Guide for Socket F (1207) Processors
32800
Rev. 3.02 3.00
August 2006
Lifting the heat sink away from the processor can result in damage to the processor contact pads, the 
socket contacts, or the socket solder-ball joints. Maintaining the spring force is important for the life 
of the processor and the socket and for repeated installations and upgrades of the processor. 
4.3.3
Heat Sink
Figure 6 shows a picture of the reference design heat sink for 1U-2P systems. The footprint of the 
heat sink is 87 mm x 74 mm. The heat sink weighs 420 g and has aluminum fins soldered to a copper 
base. The copper base tapers from a thickness of 6 mm at the center to 1.5 mm at the edges. This 
tapering provides optimum heat-spreading performance from the processor to the heat sink while 
keeping the heat sink weight within specification. The fin geometry is designed to provide optimized 
thermal performance in combination with the fans, as described in Section 4.3.4, on page 26, in a 
typical 1U-2P system.
 
Figure 6.
High Performance Heat Sink for Custom 1U-2P Systems
Table 6 shows the parameters of the aluminum fins for the high-performance heat sink shown in 
Figure 6.
Table 6.
Fin Parameters
Length
Height (at 
Center)
Height (at Edges) Thickness Pitch No. of Fins
87 mm
22 mm
26.5 mm
0.4 mm
1.48 
mm
50