Manuali utente per AMD 1207

Sommario

• Contents

  3
• List of Figures

  5
• List of Tables

  7
• Revision History

  9
• Chapter 1 Introduction

  11
  • 1.1 Summary of Requirements

    11
• Chapter 2 Processor Thermal Solutions

  13
  • 2.1 Processor Specifications

    13
    • Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors

      13
  • 2.2 Socket Description

    14
    • Figure 1. The 1207-Pin Socket

      14
• Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB) Thermal Solution

  15
  • 3.1 Motherboard Component Height Restrictions

    15
    • Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solution

      15
  • 3.2 Thermal Solution Design Requirements

    16
    • Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors

      16
  • 3.3 Sample Heat Sinks and Attachment Methods

    16
    • Table 3. Components for the Processor Thermal Reference Design for the AMD PIB Thermal Solution

      17
    • Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors

      18
    • 3.3.1 Backplate Assembly

      18
    • 3.3.2 Retention Frame

      19
• Chapter 4 Thermal Design of Custom 1U-2P Systems

  21
  • 4.1 Motherboard Component Height Restrictions

    21
    • Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems

      21
  • 4.2 Thermal Solution Design Requirements

    22
    • Table 4. Thermal Solution Design Requirements for Custom 1U-2P Systems

      22
  • 4.3 Sample Heat Sinks and Attachment Methods

    22
    • Table 5. Components for the Processor Thermal Reference Design for Custom 1U-2P Systems

      23
    • Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems

      24
    • 4.3.1 Backplate Assembly

      24
    • 4.3.2 Spring Screws

      24
    • 4.3.3 Heat Sink

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      • Figure 6. High Performance Heat Sink for Custom 1U-2P Systems

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      • Table 6. Fin Parameters

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      • Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor in 90 nm Process

        26
    • 4.3.4 Fans

      26
    • 4.3.5 Thermal Interface Material

      27
• Chapter 5 Thermal Design of Custom 2U-4P Systems

  29
  • 5.1 Motherboard Component Height Restrictions

    29
    • Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems

      29
  • 5.2 Thermal Solution Design Requirements

    30
    • Table 7. Thermal Solution Design Requirements for Custom 2U-4P Systems

      30
  • 5.3 Sample Heat Sinks and Attachment Methods

    30
    • Table 8. Components for the Processor Thermal Reference Design for Custom 2U-4P Systems

      31
    • Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors

      32
    • 5.3.1 Backplate Assembly

      32
    • 5.3.2 Spring Clip

      33
      • Table 9. Chemical Element of SK7 Spring Steel

        33
    • 5.3.3 Retention Frame

      33
    • 5.3.4 Heat Sink

      33
      • Figure 10. High Performance Heat Sink for Custom 2U-4P Systems

        34
      • Table 10. Fin Parameters

        34
      • Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor in 90 nm Process

        35
    • 5.3.5 Fans

      35
    • 5.3.6 Thermal Interface Material

      35
• Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

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  • Figure 12. Socket F (1207) PIB Board Component Height Restrictions

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  • Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone

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  • Figure 14. Socket F (1207) PIB Socket Outline and Socket Window

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  • Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone

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  • Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out

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  • Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out

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• Appendix B Keep-Out Drawings for Custom 1U- 2P Systems Based on the Socket F (1207) Processor

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  • Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions

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  • Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone

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  • Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window

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  • Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone

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  • Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out

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  • Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone

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• Appendix C Keep-Out Drawings for Custom 2U- 4P Systems Based on the Socket F (1207) Processor

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  • Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions

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  • Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone

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  • Figure 26. Socket F (1207) 2U-4P Socket Outline and Socket Window

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  • Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restriction Zone

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  • Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out

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  • Figure 29. Socket F (1207) 2U-4P Backplate Contact Zone

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• Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors

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  • Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System

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  • Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System

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