AMD 1207 Manuale Utente
Appendix B
Keep-Out Drawings for Custom 1U-2P Systems Based on the
Socket F (1207) Processor
45
Thermal Design Guide for Socket F (1207) Processors
32800
Rev. 3.00
August 2006
Appendix B
Keep-Out Drawings for Custom 1U-
2P Systems Based on the Socket F
(1207) Processor
2P Systems Based on the Socket F
(1207) Processor
Appendix B contains detailed recommended keep-out drawings for processor heat sink and mounting
hardware for a custom 1U-2P system based on the socket F (1207) processors. Depending on the
system features and layout, more space around the processor may be available for the thermal
solution than is shown in these drawings. This space permits the design of heat sinks with better
thermal performance.
hardware for a custom 1U-2P system based on the socket F (1207) processors. Depending on the
system features and layout, more space around the processor may be available for the thermal
solution than is shown in these drawings. This space permits the design of heat sinks with better
thermal performance.
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and
acoustic performance in these systems. These keep-outs are not compliant with AMD
Processor-In-a-Box (PIB) thermal solutions.
Processor-In-a-Box (PIB) thermal solutions.