Mitsubishi Electronics A172SHCPUN ユーザーズマニュアル
2. DESIGN
2
−
16
2.3.3 Instructions for External Circuit Wiring Design
(1) Wiring
(a) Use the wires of the following diameters for wiring.
Application
Recommended Wire Diameter
100VAC, 200VAC, 24VDC wires
Thickest possible wires of 2.0mm
2
max.
I/O equipment
0.75mm
2
(0.75 to 1.5mm
2
usable)
Ground wire
2.0mm
2
or more
(b) Twist the 100VAC, 200VAC and 24VDC wires as closely as possible and
run them to connect modules in the shortest distance.
(c) Instructions for using the 24VDC output of the A1S62PN power supply
module
Do not connect the 24VDC outputs of two or more power supply modules in
parallel to supply power to one I/O module. Parallel connection will damage the
power supply modules.
If one power supply module cannot provide enough 24VDC output capacity, use
an external 24VDC power supply to supply extra power.
Do not connect the 24VDC outputs of two or more power supply modules in
parallel to supply power to one I/O module. Parallel connection will damage the
power supply modules.
If one power supply module cannot provide enough 24VDC output capacity, use
an external 24VDC power supply to supply extra power.
24VDC
24VDC
Po
we
r su
p
p
ly m
o
d
u
le
I/O
module
CPU module
24VDC
External power supply
I/O
module
CPU module
CAUTION
Do not connect the 24VDC outputs of two or more power supply modules in parallel to supply
power to one I/O module. Doing so can cause burst, damage or the like.
Do not bundle the 100VAC, 200VAC and 24VDC wires with or run them close to the main circuit
(high-voltage, large-current) wires and I/O signal wires.
Separate them more than 100mm (3.94inch) where possible.
power to one I/O module. Doing so can cause burst, damage or the like.
Do not bundle the 100VAC, 200VAC and 24VDC wires with or run them close to the main circuit
(high-voltage, large-current) wires and I/O signal wires.
Separate them more than 100mm (3.94inch) where possible.