Nxp Semiconductors OM11043 사용자 매뉴얼

차례

• 1. General description

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• 2. Features and benefits

  1
• 3. Applications

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• 4. Ordering information

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  • 4.1 Ordering options

    4
• 5. Marking

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• 6. Block diagram

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• 7. Pinning information

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  • 7.1 Pinning

    7
  • 7.2 Pin description

    10
• 8. Functional description

  21
  • 8.1 Architectural overview

    21
  • 8.2 ARM Cortex-M3 processor

    21
  • 8.3 On-chip flash program memory

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  • 8.4 On-chip SRAM

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  • 8.5 Memory Protection Unit (MPU)

    21
  • 8.6 Memory map

    22
  • 8.7 Nested Vectored Interrupt Controller (NVIC)

    24
    • 8.7.1 Features

      24
    • 8.7.2 Interrupt sources

      24
  • 8.8 Pin connect block

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  • 8.9 General purpose DMA controller

    24
    • 8.9.1 Features

      25
  • 8.10 Fast general purpose parallel I/O

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    • 8.10.1 Features

      26
  • 8.11 Ethernet

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    • 8.11.1 Features

      26
  • 8.12 USB interface

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    • 8.12.1 USB device controller

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      • 8.12.1.1 Features

        27
    • 8.12.2 USB host controller

      28
      • 8.12.2.1 Features

        28
    • 8.12.3 USB OTG controller

      28
      • 8.12.3.1 Features

        28
  • 8.13 CAN controller and acceptance filters

    28
    • 8.13.1 Features

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  • 8.14 12-bit ADC

    29
    • 8.14.1 Features

      29
  • 8.15 10-bit DAC

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    • 8.15.1 Features

      29
  • 8.16 UARTs

    30
    • 8.16.1 Features

      30
  • 8.17 SPI serial I/O controller

    30
    • 8.17.1 Features

      30
  • 8.18 SSP serial I/O controller

    30
    • 8.18.1 Features

      31
  • 8.19 I2C-bus serial I/O controllers

    31
    • 8.19.1 Features

      31
  • 8.20 I2S-bus serial I/O controllers

    32
    • 8.20.1 Features

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  • 8.21 General purpose 32-bit timers/external event counters

    32
    • 8.21.1 Features

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  • 8.22 Pulse width modulator

    33
    • 8.22.1 Features

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  • 8.23 Motor control PWM

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  • 8.24 Quadrature Encoder Interface (QEI)

    34
    • 8.24.1 Features

      34
  • 8.25 Repetitive Interrupt (RI) timer

    35
    • 8.25.1 Features

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  • 8.26 ARM Cortex-M3 system tick timer

    35
  • 8.27 Watchdog timer

    35
    • 8.27.1 Features

      35
  • 8.28 RTC and backup registers

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    • 8.28.1 Features

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  • 8.29 Clocking and power control

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    • 8.29.1 Crystal oscillators

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      • 8.29.1.1 Internal RC oscillator

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      • 8.29.1.2 Main oscillator

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      • 8.29.1.3 RTC oscillator

        37
    • 8.29.2 Main PLL (PLL0)

      38
    • 8.29.3 USB PLL (PLL1)

      38
    • 8.29.4 RTC clock output

      38
    • 8.29.5 Wake-up timer

      38
    • 8.29.6 Power control

      39
      • 8.29.6.1 Sleep mode

        39
      • 8.29.6.2 Deep-sleep mode

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      • 8.29.6.3 Power-down mode

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      • 8.29.6.4 Deep power-down mode

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      • 8.29.6.5 Wake-up interrupt controller

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    • 8.29.7 Peripheral power control

      40
    • 8.29.8 Power domains

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  • 8.30 System control

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    • 8.30.1 Reset

      42
    • 8.30.2 Brownout detection

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    • 8.30.3 Code security (Code Read Protection - CRP)

      43
    • 8.30.4 APB interface

      43
    • 8.30.5 AHB multilayer matrix

      44
    • 8.30.6 External interrupt inputs

      44
    • 8.30.7 Memory mapping control

      44
  • 8.31 Emulation and debugging

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• 9. Limiting values

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• 10. Thermal characteristics

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• 11. Static characteristics

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  • 11.1 Power consumption

    50
  • 11.2 Peripheral power consumption

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  • 11.3 Electrical pin characteristics

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• 12. Dynamic characteristics

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  • 12.1 Flash memory

    56
  • 12.2 External clock

    56
  • 12.3 Internal oscillators

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  • 12.4 I/O pins

    57
  • 12.5 I2C-bus

    58
  • 12.6 I2S-bus interface

    59
  • 12.7 SSP interface

    61
  • 12.8 USB interface

    63
  • 12.9 SPI

    64
• 13. ADC electrical characteristics

  66
• 14. DAC electrical characteristics

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• 15. Application information

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  • 15.1 Suggested USB interface solutions

    70
  • 15.2 Crystal oscillator XTAL input and component selection

    73
  • 15.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines

    74
  • 15.4 Standard I/O pin configuration

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  • 15.5 Reset pin configuration

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  • 15.6 ElectroMagnetic Compatibility (EMC)

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• 16. Package outline

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• 17. Soldering

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• 18. Abbreviations

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• 19. References

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• 20. Revision history

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• 21. Legal information

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  • 21.1 Data sheet status

    86
  • 21.2 Definitions

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  • 21.3 Disclaimers

    86
  • 21.4 Trademarks

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• 22. Contact information

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• 23. Contents

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