Toshiba Xeon 2.8GHz UPG3843W 用户手册

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 Datasheet

 

This section documents the mechanical specifications of the boxed processor passive heatsink and
the PWT.

Proper clearance is required around the heatsink to ensure proper installation of the processor and
unimpeded airflow for proper cooling.

The boxed processor is shipped with an unattached passive heatsink. Clearance is required around
the heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and
dimensions for the boxed Intel® Xeon™ processor with 512KB L2 cache assembled heatsink are
shown in 

 (Multiple Views). The airflow requirements for the boxed processor heatsink

must also be taken into consideration when designing new baseboards and chassis. The airflow
requirements are detailed in the Thermal Specifications, 

.

The boxed processor heatsink weighs no more than 450 grams. See 

 and 

this document along with the Intel

 Processor Family Thermal Design Guidelines  for

details on the processor weight and heatsink requirements.