Intel 820E Benutzerhandbuch

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Intel
®
 820E Chipset 
 
 
 
 
R
 
120  
Design 
Guide 
There are four pins which are used to put the Intel 82562ET/EM controller in different operating states: 
Test_En, Isol_Tck, Isol_Ti, and Isol_Tex. The table below describes the operational/disable features for 
this design. 
Test_En Isol_Tck Isol_Ti Isol_Tex 
State 
0 0 0 0 
Enabled 
Disabled w/ Clock (low power) 
Disabled w/out Clock (lowest power) 
The four control signals shown in the above table should be configured as follows: Test_En should be 
pulled-down thru a 100 
Ω
 resistor. The remaining 3 control signals should each be connected thru 100 
 Ω
 
series resistors to the common node “82652ET/EH_Disable” of the disable circuit. 
2.22.6. Intel
®
 82562ET and Intel
®
 82562EH Components’ Dual-
Footprint Guidelines 
These guidelines explain the proper layout for a dual-footprint solution. This configuration allows the 
developer to install either the Intel
 
82562EH or Intel
 
82562ET/82562EM component, with only one 
motherboard design. The following guidelines are for the Intel
 
82562ET/82562EH components’ dual-
footprint option. The guidelines called out in Sections 2.22.1 and 2.22.4 apply to this configuration. The 
dual footprint for this particular solution uses a SSOP footprint for the Intel
 
82562ET component and a 
TQFP footprint for the Intel
 
82562EH component. The combined footprint for this configuration is 
Figure 76. Dual-Footprint LAN Connect Interface 
 
IO_subsys_dual_footprint_LAN_conn_IF
 
ICH
LAN_TXD[2:
LAN_RXD[2:
LAN_RSTSY
LAN_CL
8
2
5
6
2
T
Stub
Intel
®
 
82562EH 
TQF