Intel 945P Benutzerhandbuch

Product Specifications

Thermal and Mechanical Design Guidelines

Figure 1. (G)MCH Non-Grid Array

2.2

Package Loading Specifications

Table 1 provides static load specifications for the chipset package. This mechanical

maximum load limit should not be exceeded during heatsink assembly, shipping

conditions, or standard use conditions. Also, any mechanical system or component

testing should not exceed the maximum limit. The chipset package substrate should

not be used as a mechanical reference or load-bearing surface for the thermal and

mechanical solution.

Table 1. (G)MCH Loading Specifications

Parameter Maximum

Notes

Static 15

lbf

1,2,3

NOTES:

1. These specifications apply to uniform compressive loading in a direction normal to the

(G)MCH package.

2. This is the maximum force that can be applied by a heatsink retention clip. The clip must

also provide the minimum specified load on the (G)MCH package.

3. These specifications are based on limited testing for design characterization. Loading limits

are for the package only.