Intel 945P Benutzerhandbuch

Thermal and Mechanical Design Guidelines   

 13 

To ensure proper operation and reliability of the (G)MCH, the temperature must be at 

or below the maximum value specified in Table 2. System and component level 

thermal enhancements are required to dissipate the heat generated and maintain the 
(G)MCH within specifications. Chapter 

3 provides the thermal metrology guidelines for 

case temperature measurements.  

The (G)MCH must also operate above the minimum case temperature specification 

listed in Table 2. 

T

C-MAX

 

82945G/82945GZ/82945GC GMCH: 99 °C 

82945P/82945PL MCH : 103°C 

T

C-MIN

 0 

°C 

NOTE: Thermal specifications assume an attached heatsink is present. 

Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based 

on normal operating conditions including V

CC

 and T

C-MAX

 while executing real worst-

case power intensive applications. This value is based on expected worst-case data 

traffic patterns and usage of the (G)MCH and does not represent a specific software 

application. TDP attempts to account for expected increases in power due to variation 

in (G)MCH current consumption due to silicon process variation, processor speed, 

DRAM capacitive bus loading and temperature. However, since these variations are 

subject to change, the TDP cannot ensure that all applications will not exceed the TDP 

value.  

The system designer must design a thermal solution for the (G)MCH such that it 

maintains T

C

 below T

C-MAX

 for a sustained power level equal to TDP. Note that the T

C-

MAX

 specification is a requirement for a sustained power level equal to TDP, and that 

the case temperature must be maintained at temperatures less than T

C-MAX

 when 

operating at power levels less than TDP. This temperature compliance is to ensure 

(G)MCH reliability over its useful life. The TDP value can be used for thermal design if 

the (G)MCH thermal protection mechanisms are enabled. Intel chipsets incorporate a 

hardware-based fail-safe mechanism to help keep the product temperature within 

specifications in the event of unusually strenuous usage above the TDP power limit.