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Intel
945P
Benutzerhandbuch
Intel 945P Benutzerhandbuch
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Thermal and Mechanical Design Guidelines
3
Contents
1
Introduction .....................................................................................................7
1.1
Terminology ..........................................................................................8
1.2
Reference Documents .............................................................................9
2
Product Specifications......................................................................................11
2.1
Package Description..............................................................................11
2.1.1
Non-Grid Array Package Ball Placement ......................................11
2.2
Package Loading Specifications...............................................................12
2.3
Thermal Specifications ..........................................................................13
2.4
Thermal Design Power (TDP)..................................................................13
2.4.1
Methodology...........................................................................14
2.4.2
Application Power....................................................................14
2.4.3
Specifications .........................................................................14
3
Thermal Metrology ..........................................................................................15
3.1
Case Temperature Measurements ...........................................................15
3.1.1
Thermocouple Attach Methodology.............................................15
3.2
Airflow Characterization ........................................................................16
4
Reference Thermal Solution..............................................................................19
4.1
Operating Environment .........................................................................19
4.1.1
ATX Form Factor Operating Environment ....................................19
4.1.2
Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................20
4.2
Mechanical Design Envelope...................................................................21
4.3
Thermal Solution Assembly....................................................................21
4.4
Environmental Reliability Requirements ...................................................24
Appendix A
Enabled Suppliers ...........................................................................................25
Appendix B
Mechanical Drawings .......................................................................................27
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