Intel 945P ユーザーズマニュアル

Intel

Thermal and Mechanical Design Guidelines

3

Contents

Introduction .....................................................................................................7

Terminology ..........................................................................................8

Reference Documents .............................................................................9

Product Specifications......................................................................................11

Package Description..............................................................................11

Non-Grid Array Package Ball Placement ......................................11

Package Loading Specifications...............................................................12

Thermal Specifications ..........................................................................13

Thermal Design Power (TDP)..................................................................13

Methodology...........................................................................14

Application Power....................................................................14

Specifications .........................................................................14

Thermal Metrology ..........................................................................................15

Case Temperature Measurements ...........................................................15

Thermocouple Attach Methodology.............................................15

Airflow Characterization ........................................................................16

Reference Thermal Solution..............................................................................19

Operating Environment .........................................................................19

ATX Form Factor Operating Environment ....................................19

Balanced Technology Extended (BTX) Form Factor Operating

Environment...........................................................................20

Mechanical Design Envelope...................................................................21

Thermal Solution Assembly....................................................................21

Environmental Reliability Requirements ...................................................24

Enabled Suppliers ...........................................................................................25

Mechanical Drawings .......................................................................................27