Intel 220 LE80557RE009512 Datenbogen
Produktcode
LE80557RE009512
Package Mechanical Specifications and Pin Information
34
Datasheet
4.1.3
Processor Mass Specifications
The typical mass is given in
. This mass includes all the
components that are included in the package.
Table 16.
Micro-FCBGA Package Mechanical Specifications
Symbol
Parameter
Min
Max
Unit
Figure
B1
Package substrate width
34.95
35.05
mm
B2
Package substrate length
34.95
35.05
mm
C1
Die width
11.1
mm
C2
Die length
8.2
mm
F2
Die height (with underfill)
0.89
mm
F3
Package overall height (package
substrate to die)
substrate to die)
2.022 Max
mm
G1
Width (first ball center to lass ball
center)
center)
31.75 Basic
mm
G2
Length (first ball center to last ball
center)
center)
31.75 Basic
mm
J1
Ball pitch (horizontal)
1.27 Basic
mm
J2
Ball pitch (vertical)
1.27 Basic
mm
M
Solder Resist Opening
0.61
0.69
mm
N
Ball height
0.6
0.8
mm
—
Corener Keep-out zone at corner
(4X)
(4X)
7 x 7
mm
—
Keep-out from edge of package
(4x)
(4x)
5
mm
—
Package edge to first ball center
1.625
mm
P
die
Allowable pressure on the die for
thermal solution
thermal solution
689
kPa
W
Package weight
6
g