Intel 220 LE80557RE009512 Scheda Tecnica

Codici prodotto

LE80557RE009512

Package Mechanical Specifications and Pin Information

Datasheet

4.1.3

Processor Mass Specifications

The typical mass is given in

Figure 4

and

Table 16

. This mass includes all the

components that are included in the package.

Table 16.

Micro-FCBGA Package Mechanical Specifications

Symbol

Parameter

Min

Max

Unit

Figure

Package substrate width

34.95

35.05

Figure 4

Package substrate length

34.95

35.05

Figure 4

Die width

11.1

Figure 4

Die length

8.2

Figure 4

Die height (with underfill)

0.89

Figure 4

Package overall height (package
substrate to die)

2.022 Max

Figure 4

Width (first ball center to lass ball
center)

31.75 Basic

Figure 4

Length (first ball center to last ball
center)

31.75 Basic

Figure 4

Ball pitch (horizontal)

1.27 Basic

Figure 4

Ball pitch (vertical)

1.27 Basic

Figure 4

Solder Resist Opening

0.61

0.69

Figure 4

Ball height

0.6

0.8

Figure 4

—

Corener Keep-out zone at corner
(4X)

7 x 7

Figure 5

—

Keep-out from edge of package
(4x)

Figure 5

—

Package edge to first ball center

1.625

Figure 5

die

Allowable pressure on the die for
thermal solution

689

kPa

Package weight