Intel E7320 LF80565QH0464M Datenbogen
Produktcode
LF80565QH0464M
Electrical Specifications
26
Document Number: 318080-002
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processors and are based on estimates
and simulations, not empirical data. These specifications will be updated with characterized data from
silicon measurements at a later date.
2.
These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See
for more information.
3.
The voltage specification requirements are measured across the VCC_SENSE and VSS_SENSE pins and
across the VCC_SENSE2 and VSS_SENSE2 pins with an oscilloscope set to 100 MHz bandwidth, 1.5 pF
maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the
probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
4.
The processor must not be subjected to any static V
CC
level that exceeds the V
CC_MAX
associated with any
particular current. Failure to adhere to this specification can shorten processor lifetime.
5.
I
CC_MAX
specification is based on maximum V
CC
for details. The processor is
capable of drawing I
CC_MAX
current draw over various time durations.
6.
FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only. See
for further details on FMB guidelines.
7.
This specification represents the total current for GTLREF_DATA_MID, GTLREF_DATA_END,
GTLREF_ADD_MID, and GTLREF_ADD_END.
8.
V
TT
must be provided via a separate voltage source and must not be connected to V
CC
. This specification is
measured at the pin.
I
TT
I
CC
for V
TT
supply before V
CC
stable
I
CC
for V
TT
supply after V
CC
stable
8.0
7.0
A
15
I
CC_TDC
Thermal Design Current (TDC) Quad-
Core Intel® Xeon® L7345 Processor
Launch - FMB
Launch - FMB
50
A
6,14
I
CC_TDC
Thermal Design Current (TDC) Dual-
Core Intel® Xeon® Processor 7200
Series
Launch - FMB
Launch - FMB
75
A
6,14
I
CC_TDC
Thermal Design Current (TDC) Intel
®
Xeon
®
Processor 7200 Series and 7300
Series
Launch - FMB
Launch - FMB
75
A
6,14
I
CC_TDC
Thermal Design Current (TDC) Intel®
Xeon® X7350 Processor
Launch - FMB
Launch - FMB
110
A
6,14
I
CC_VTT_OUT
DC current that may be drawn from
V
TT_OUT
per pin
580
mA
16
I
CC_GTLREF
I
CC
for
GTLREF_DATA_MID,
GTLREF_DATA_END,
GTLREF_ADD_MID, and
GTLREF_ADD_END
200
µA
7
I
CC_VCCPLL
I
CC
for PLL supply
260
mA
12
I
TCC
I
CC
for Quad-Core Intel® Xeon® L7345
Processor during active thermal control
circuit (TCC)
60
A
I
TCC
I
CC
for Dual-Core Intel® Xeon®
Processor 7200 Series during active
thermal control circuit (TCC)
90
A
I
TCC
I
CC
for Dual-Core Intel® Xeon®
Processor 7200 Series and Quad-Core
Intel® Xeon® Processor 7300 Series
during active thermal control circuit
(TCC)
90
A
I
TCC
I
CC
for Intel® Xeon® X7350 Processor
during active thermal control circuit
(TCC)
130
A
Table 2-9.
Voltage and Current Specifications (Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1,17