Intel E7320 LF80565QH0464M Data Sheet

26

Document Number: 318080-002

1.

Unless otherwise noted, all specifications in this table apply to all processors and are based on estimates 

and simulations, not empirical data. These specifications will be updated with characterized data from 

silicon measurements at a later date.

2.

These voltages are targets only. A variable voltage source should exist on systems in the event that a 

different voltage is required. See 

 for more information. 

3.

The voltage specification requirements are measured across the VCC_SENSE and VSS_SENSE pins and 

across the VCC_SENSE2 and VSS_SENSE2 pins with an oscilloscope set to 100 MHz bandwidth, 1.5 pF 

maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the 

probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe. 

4.

The processor must not be subjected to any static V

CC

 level that exceeds the V

CC_MAX

 associated with any 

particular current. Failure to adhere to this specification can shorten processor lifetime.

5.

I

CC_MAX

 specification is based on maximum V

CC 

loadline Refer to 

 for details. The processor is 

capable of drawing I

CC_MAX 

for up to 10 ms. Refer to 

 for further details on the average processor 

current draw over various time durations.

6.

FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only. See 

 for further details on FMB guidelines.

7.

This specification represents the total current for GTLREF_DATA_MID, GTLREF_DATA_END, 

GTLREF_ADD_MID, and GTLREF_ADD_END.

8.

V

TT

 must be provided via a separate voltage source and must not be connected to V

CC

. This specification is 

measured at the pin.

I

TT

I

CC

 for V

TT

 supply before V

CC

 stable

I

CC

 for V

TT

 supply after V

CC

 stable

8.0

7.0

A

15

I

CC_TDC

Thermal Design Current (TDC) Quad-

Core Intel® Xeon® L7345 Processor 
Launch - FMB

50

A

6,14

I

CC_TDC

Thermal Design Current (TDC) Dual-

Core Intel® Xeon® Processor 7200 

Series
Launch - FMB

75

A

6,14

I

CC_TDC

Thermal Design Current (TDC) Intel

®

 

Xeon

®

 Processor 7200 Series and 7300 

Series
Launch - FMB

75

A

6,14

I

CC_TDC

Thermal Design Current (TDC) Intel® 

Xeon® X7350 Processor 
Launch - FMB

110

A

6,14

I

CC_VTT_OUT

DC current that may be drawn from 

V

TT_OUT 

per pin 

580

mA

16

I

CC_GTLREF

I

CC

 for 

GTLREF_DATA_MID, 

GTLREF_DATA_END, 

GTLREF_ADD_MID, and 

GTLREF_ADD_END

200

µA

7

I

CC_VCCPLL

I

CC

 for PLL supply

260

mA

12

I

TCC

I

CC

 for Quad-Core Intel® Xeon® L7345 

Processor during active thermal control 

circuit (TCC)

60

A

I

TCC

I

CC

 for Dual-Core Intel® Xeon® 

Processor 7200 Series during active 

thermal control circuit (TCC)

90

A

I

TCC

I

CC

 for Dual-Core Intel® Xeon® 

Processor 7200 Series and Quad-Core 

Intel® Xeon® Processor 7300 Series 

during active thermal control circuit 

(TCC)

90

A

I

TCC

I

CC

 for Intel® Xeon® X7350 Processor  

during active thermal control circuit 

(TCC)

130

A