Acer Intel Celeron G530 KC.53001.CDG Benutzerhandbuch

82

 Datasheet

The

 

Celeron processor 0.13 micron process requires a thermal solution to maintain temperatures 

within the operating limits as set forth in 

. Any attempt to operate the processor 

outside these operating limits may result in permanent damage to the processor and potentially 
other components in the system. As processor technology changes, thermal management becomes 
increasingly crucial when building computer systems. Maintaining the proper thermal environment 
is key to reliable, long-term system operation.

A complete thermal solution includes both component and system level thermal management 
features. Component-level thermal solutions can include active or passive heatsinks attached to the 
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of 
system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to Intel

Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guide.

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the 
system/processor thermal solution should be designed such that the processor remains within the 
minimum and maximum case temperature (T

C

) specifications when operating at or below the 

Thermal Design Power (TDP) value listed per frequency in 

. Thermal solutions not 

designed to provide this level of thermal capability may affect the long-term reliability of the 
processor and system. For more details on thermal solution design, refer to the appropriate 
processor thermal design guidelines. 

The case temperature is defined at the geometric top center of the processor IHS. Analysis 
indicates that real applications are unlikely to cause the processor to consume maximum power 
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs 
target the Thermal Design Power (TDP) indicated in 

 instead of the maximum processor 

power consumption. The Thermal Monitor feature is intended to help protect the processor in the 
unlikely event that an application exceeds the TDP recommendation for a sustained period of time. 
For more details on the usage of this feature, refer to 

. To ensure maximum flexibility 

for future requirements, systems should be designed to the Flexible Motherboard (FMB) 
guidelines, even if a processor with a lower thermal dissipation is currently planned. In all cases, 
the Thermal Monitor feature must be enabled for the processor to remain within 
specification.

Multiple VID processors will be shipped either at VID=1.475 V, VID=1.500 V, or VID=1.525 V. 
Processors with multiple VIDs have TDP _max of the highest VID for the specified frequency. For 
example, for the processors through 2.40 GHz, the TDP would be 59.8 W.