Intel MFS5000SI MFS5000SIB Benutzerhandbuch
Produktcode
MFS5000SIB
Revision History
Intel® Compute Module MFS5000SI TPS
Revision History
Date
Revision
Number
Modifications
July 2007
0.95
Initial release.
August 2007
0.96
Updated
September 2007
1.0
Updated
February 2008
1.1
Updated
November 2008
1.2
Updated
May 2009
1.3
Updated
June 2009
1.4
Updated supported memory configurations
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®
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products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for
use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and
product descriptions at any time, without notice.
as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel
products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for
use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and
product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility
whatsoever for conflicts or incompatibilities arising from future changes to them.
"reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility
whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Compute Module MFS5000SI may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on
request.
request.
Intel Corporation server baseboards support peripheral components and contain a number of high-
density VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are
designed and tested to meet the intended thermal requirements of these components when the fully
integrated system is used together. It is the responsibility of the system integrator that chooses not to use
Intel developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental conditions. Intel
Corporation can not be held responsible if components fail or the compute module does not operate
correctly when used outside any of their published operating or non-operating limits.
density VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are
designed and tested to meet the intended thermal requirements of these components when the fully
integrated system is used together. It is the responsibility of the system integrator that chooses not to use
Intel developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental conditions. Intel
Corporation can not be held responsible if components fail or the compute module does not operate
correctly when used outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2007-2009.
Revision 1.4
Intel order number: E15154-007
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