Texas Instruments 9A, 3V to 4V Vin, SWIFT™ Converter Evaluation Module TPS54917EVM-367 TPS54917EVM-367 Datenbogen
Produktcode
TPS54917EVM-367
3
Board Layout
3.1
Layout
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Board Layout
Figure 10. TPS54917EVM-367 Thermal Image
This section provides a description of the TPS54917EVM-367, board layout, and layer illustrations.
The board layout for the TPS54917EVM-367is shown in
through
. The topside layer of
the EVM is laid out in a manner typical of a user application. The top, bottom and internal layers are 2-oz.
copper.
copper.
The top layer contains the main power traces for V
IN
, V
OUT
, and VPHASE. Also on the top layer are
connections for the remaining pins of the TPS54917 and a large area filled with ground. The bottom and
internal layers are dedicated ground planes. The top and bottom and internal ground areas are connected
with multiple vias placed around the board including twelve vias directly under the TPS54917 device to
provide a thermal path from the top-side ground plane to the bottom-side and internal ground planes.
internal layers are dedicated ground planes. The top and bottom and internal ground areas are connected
with multiple vias placed around the board including twelve vias directly under the TPS54917 device to
provide a thermal path from the top-side ground plane to the bottom-side and internal ground planes.
SLVU278 – December 2008
TPS54917EVM-367 9-A, SWIFT™ Regulator Evaluation Module
9