Texas Instruments Development Kit for TM4C129x,Tiva™ ARM® Cortex™ -M4 Microcontroller DK-TM4C129X DK-TM4C129X Datenbogen
Produktcode
DK-TM4C129X
32.2
Operating Characteristics
Table 32-3. Temperature Characteristics
Unit
Value
Symbol
Characteristic
°C
-40 to 85 (industrial
temperature part)
temperature part)
-40 to 105
(extended
temperature part)
(extended
temperature part)
T
A
Ambient operating temperature range
°C
-40 to 105
(industrial
temperature part)
(industrial
temperature part)
-40 to 125
(extended
temperature part)
(extended
temperature part)
T
J
Junction operating temperature range
Table 32-4. 212 BGA Power Dissipation
ab
Unit
Max
Min
T
J
T
A
Parameter Name
Parameter
mW
1018
-
125 °C (industrial
temperature part)
temperature part)
85 °C (industrial
temperature part)
temperature part)
Industrial temperature device
power dissipation
power dissipation
P
DI
mW
509
-
125 °C (extended
temperature part)
temperature part)
105 °C (extended
temperature part)
temperature part)
Extended temperature device
power dissipation
power dissipation
P
DE
a. If the device exceeds the power dissipation value shown, then modifications such as heat sinks or fans must be used to
conform to the limits shown.
b. A larger power dissipation allowance can be achieved by lowering T
A
as long as T
JMAX
shown in Table 32-1 on page 2101
is not exceeded.
Table 32-5. Thermal Characteristics
a
Unit
Value
Symbol
Characteristic
°C/W
39.3
Θ
JA
Thermal resistance (junction to ambient)
b
°C/W
18.6
Θ
JB
Thermal resistance (junction to board)
b
°C/W
12.9
Θ
JC
Thermal resistance (junction to case)
b
°C/W
0.2
Ψ
JT
Thermal metric (junction to top of
package)
package)
°C/W
18.4
Ψ
JB
Thermal metric (junction to board)
°C
T
C
+ (P • Ψ
JT
)
c
T
PCB
+ (P • Ψ
JB
)
d
T
A
+ (P • Θ
JA
)
e
T
B
+ (P • Θ
JB
)
fg
T
J
Junction temperature formula
a. For more details about thermal metrics and definitions, see the Semiconductor and IC Package Thermal Metrics Application
Report (literature number
).
b. Junction to ambient thermal resistance (Θ
JA
), junction to board thermal resistance (Θ
JB
), and junction to case thermal
resistance (Θ
JC
) numbers are determined by a package simulator.
c. T
C
is the case temperature and P is the device power consumption.
d. T
PCB
is the temperature of the board acquired by following the steps listed in the EAI/JESD 51-8 standard summarized
in the Semiconductor and IC Package Thermal Metrics Application Report (literature number
). P is the device
power consumption.
e. Because Θ
JA
is highly variable and based on factors such as board design, chip/pad size, altitude, and external ambient
temperature, it is recommended that equations containing Ψ
JT
and Ψ
JB
be used for best results.
f. T
B
is temperature of the board.
December 13, 2013
2102
Texas Instruments-Advance Information
Electrical Characteristics