Microchip Technology MA330031-2 Datenbogen
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
DS70000657H-page 402
2011-2013 Microchip Technology Inc.
30.1
DC Characteristics
TABLE 30-1:
OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD
Range
(in Volts)
Temp Range
(in °C)
Maximum MIPS
dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X and
PIC24EPXXXGP/MC20X
—
3.0V to 3.6V
(
)
-40°C to +85°C
70
—
3.0V to 3.6V
(
)
-40°C to +125°C
60
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules (ADC, op amp/comparator and
comparator voltage reference) may have degraded performance. Device functionality is tested but not
characterized. Refer to Parameter
characterized. Refer to Parameter
for the minimum and maximum BOR values.
TABLE 30-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min.
Typ.
Max.
Unit
Industrial Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Extended Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+140
°C
Operating Ambient Temperature Range
T
A
-40
—
+125
°C
Power Dissipation:
Internal chip power dissipation:
Internal chip power dissipation:
P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O =
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
– T
A
)/
JA
W
TABLE 30-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ.
Max.
Unit
Notes
Package Thermal Resistance, 64-Pin QFN
JA
28.0
—
°C/W
Package Thermal Resistance, 64-Pin TQFP 10x10 mm
JA
48.3
—
°C/W
Package Thermal Resistance, 48-Pin UQFN 6x6 mm
JA
41
—
°C/W
Package Thermal Resistance, 44-Pin QFN
JA
29.0
—
°C/W
Package Thermal Resistance, 44-Pin TQFP 10x10 mm
JA
49.8
—
°C/W
Package Thermal Resistance, 44-Pin VTLA 6x6 mm
JA
25.2
—
°C/W
Package Thermal Resistance, 36-Pin VTLA 5x5 mm
JA
28.5
—
°C/W
Package Thermal Resistance, 28-Pin QFN-S
JA
30.0
—
°C/W
Package Thermal Resistance, 28-Pin SSOP
JA
71.0
—
°C/W
Package Thermal Resistance, 28-Pin SOIC
JA
69.7
—
°C/W
Package Thermal Resistance, 28-Pin SPDIP
JA
60.0
—
°C/W
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.