Linear Technology LTM2881-3 RS485 µModule Isolator Demo Board (3.3V Supply) DC1503A-A DC1503A-A Datenbogen
Produktcode
DC1503A-A
LTM2881
21
2881ff
For more information
5. PRIMAR
Y DA
TUM -Z- IS SEA
TING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
PACKAGE ROW AND COLUMN LABELING MA
Y V
AR
Y
AMONG µModule PRODUCTS. REVIEW EACH P
ACKAGE
LA
YOUT CAREFULL
Y
!
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. A
LL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNA
TION PER JESD MS-028 AND JEP95
4
3
DET
AILS OF PIN #1 IDENTIFIER ARE OP
TIONAL,
BUT MUST BE LOCA
TED WITHIN THE ZONE INDICA
TED.
THE PIN #1 IDENTIFIER MA
Y BE EITHER A MOLD OR
MARKED FEA
TURE
PACKAGE TOP VIEW
4
PIN “A1” CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOT
TOM VIEW
3
SEE NOTES
SUGGESTED PCB LA
YOUT
TOP VIEW
BGA 32
1112 REV D
LTMXXXXXX µModule
TRA
Y PIN 1 BEVEL
PACKAGE IN TRA
Y LOADING ORIENT
ATION
COMPONENT
PIN “A1”
DET
AIL A
PIN 1
0.000
0.635
0.635
1.905
1.905
3.175
3.175
4.445
4.445
6.350
6.350
5.080
5.080
0.000
DET
AIL A
Øb (32 PLACES)
F
G
H
L
J
K
E
A
B
C
D
2
1
4
3
5
6
7
8
DET
AIL B
SUBSTRA
TE
0.27 – 0.37
2.45 – 2.55
// bbb Z
D
A
A1
b1
ccc Z
DET
AIL B
PACKAGE SIDE VIEW
MOLD CAP
Z
M
X
Y
Z
ddd
M
Z
eee
0.630 ±0.025 Ø 32x
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.60
0.60
NOM
3.42
0.60
2.82
0.75
0.63
15.0
11.25
1.27
12.70
8.89
MAX
3.62
0.70
2.92
0.90
0.66
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOT
AL NUMBER OF BALLS: 32
E
b
e
e
b
A2
F
G
BGA Package
32-Lead (15mm
×
11.25mm
×
3.42mm)
(Reference LTC DWG # 05-08-1851 Rev D)
7
SEE NOTES
package DescripTion
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.