Linear Technology LTM2881-3 RS485 µModule Isolator Demo Board (3.3V Supply) DC1503A-A DC1503A-A Datenbogen
Produktcode
DC1503A-A
LTM2881
22
2881ff
package DescripTion
LGA Package
32-Lead (15mm
× 11.25mm
× 2.8mm)
(Reference L
TC DWG # 05-08-1773 Rev
q)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. A
LL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNA
TION PER JESD MO-222
5. PRIMAR
Y DA
TUM -Z- IS SEA
TING PLANE
6. T
HE TOT
AL NUMBER OF P
ADS: 32
4
3
DET
AILS OF P
AD #1 IDENTIFIER ARE OP
TIONAL,
BUT MUST BE LOCA
TED WITHIN THE ZONE INDICA
TED.
THE P
AD #1 IDENTIFIER MA
Y BE EITHER A MOLD OR
MARKED FEA
TURE
DET
AIL B
DET
AIL B
SUBSTRA
TE
MOLD CAP
0.290 – 0.350
2.400 – 2.600
bbb Z
Z
PACKAGE TOP VIEW
11.25 BSC
15.00 BSC
4
PAD “A1” CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOT
TOM VIEW
3
PADS SEE NOTES
SUGGESTED PCB LA
YOUT
TOP VIEW
LGA 32 0308 REV Ø
LTMXXXXXX µModule
TRA
Y PIN 1 BEVEL
PACKAGE IN TRA
Y LOADING ORIENT
ATION
COMPONENT
PIN “A1”
8.89 BSC
1.27 BSC
PAD 1
0.635
0.635
1.905
1.905
3.175
3.175
4.445
4.445
6.350
6.350
5.080
5.080
0.000
SYMBOL
aaa
bbb
eee
TOLERANCE
0.10
0.10
0.05
DET
AIL A
0.630 ±0.025 Ø 32x
S
Y
X
eee
DET
AIL C
0.630 ±0.025 Ø 32x
S
Y
X
eee
F
G
H
L
J
K
E
A
B
C
D
2
1
4
3
5
6
7
2.69 – 2.95
DET
AIL A
12.70 BSC
8
DET
AIL c
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.