Intel 1.40 GHz RH80532NC017256 Datenbogen
Produktcode
RH80532NC017256
Mobile Intel
®
Celeron
®
Processor (0.13 µ) in
Micro-FCBGA and Micro-FCPGA Packages Datasheet
80 Datasheet
298517-006
6. V
CC
Thermal Specifications
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat pipe, or
other heat transfer system) must make firm contact to the exposed processor die. The processor die must
be clean before the thermal solution is attached or the processor may be damaged.
other heat transfer system) must make firm contact to the exposed processor die. The processor die must
be clean before the thermal solution is attached or the processor may be damaged.
Table 48 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum T
J
temperatures for the Mobile Intel Celeron Processor. The thermal solution should be designed to ensure
the junction temperature never exceeds the specified value while operating at the Thermal Design
Power. Additionally, a secondary failsafe mechanism in hardware should be provided to shutdown the
processor at 101
the junction temperature never exceeds the specified value while operating at the Thermal Design
Power. Additionally, a secondary failsafe mechanism in hardware should be provided to shutdown the
processor at 101
°
C to prevent permanent damage, as described in Section 3.1.3. TDP is a thermal
design power specification based on the worst case power dissipation of the processor while executing
publicly available software under normal operating conditions at nominal voltages. Contact your Intel
Field Sales Representative for further information.
publicly available software under normal operating conditions at nominal voltages. Contact your Intel
Field Sales Representative for further information.