CyberpowerPC Microphone MPC603EC Benutzerhandbuch
18
603 Hardware Specifications, REV 2
Preliminary—Subject to Change without Notice
1.6.1.2 Mechanical Dimensions of the Motorola Wire-Bond CQFP Package
Figure 10 shows the mechanical dimensions for the wire-bond CQFP package.
Figure 10. Mechanical Dimensions of the Motorola Wire-Bond CQFP Package
*Reduced pin count shown for clarity. 60 pins per side
Min.
Max.
A
30.86 31.75
B
34.6 BSC
C
3.75
4.15
D
0.5 BSC
E
0.18
0.30
F
3.10
3.90
G
0.13
0.175
H
0.45
0.55
J
0.25
–
AA
1.80 REF
AB
0.95 REF
θ
1
2
°
6
°
θ
2
1
°
7
°
R
0.15 REF
–H–
AB
θ
I
R
R
AA
θ
2
H
Pin 240
C
A
B
Pin 1
D
E
*Not to scale
G
F
J
Die
Wire Bonds
Ceramic Body
Alloy 42 Leads
Notes: 1. BSC—Between Standard Centers.
2. All measurements in mm.