Benutzerhandbuch für CyberpowerPC Microphone MPC603EC

Inhaltsverzeichnis

• 1.1 Overview

  2
  • 1.1.1 PowerPC 603 Microprocessor Features

    2
• 1.2 General Parameters

  4
• 1.3 Electrical and Thermal Characteristics

  4
  • 1.3.1 DC Electrical Characteristics

    4
  • 1.3.2 AC Electrical Characteristics

    6
    • 1.3.2.1 Clock AC Specifications

      6
    • 1.3.2.2 Input AC Specifications

      7
    • 1.3.2.3 Output AC Specifications

      9
  • 1.3.3 JTAG AC Timing Specifications

    12
• 1.4 Pinout Diagram

  14
• 1.5 Pinout Listing

  15
• 1.6 Package Description

  17
  • 1.6.1 Motorola Wire-Bond CQFP Package Description

    17
    • 1.6.1.1 Package Parameters

      17
    • 1.6.1.2 Mechanical Dimensions of the Motorola Wire...

      18
  • 1.6.2 IBM C4-CQFP Package Description

    19
    • 1.6.2.1 Package Parameters

      19
    • 1.6.2.2 Mechanical Dimensions of the IBM C4-CQFP P...

      20
• 1.7 System Design Information

  21
  • 1.7.1 PLL Configuration

    21
  • 1.7.2 PLL Power Supply Filtering

    22
  • 1.7.3 Decoupling Recommendations

    22
  • 1.7.4 Connection Recommendations

    22
  • 1.7.5 Thermal Management Information for the Motor...

    22
    • 1.7.5.1 Thermal Characteristics for the Motorola W...

      22
    • 1.7.5.2 Thermal Management Example

      22
  • 1.7.6 Thermal Management Information for the IBM P...

    24
    • 1.7.6.1 Thermal Characteristics for the IBM C4-CQF...

      24
    • 1.7.6.2 Thermal Management Example

      24
• 1.8 Ordering Information

  26
  • 1.8.1 Motorola Part Number Key

    26
  • 1.8.2 IBM Part Number Key

    26
• A.1 Package Environmental, Operation, Shipment, A....

  27
• A.2 Card Assembly Recommendations

  28
  • A.2.1 Card Assembly Process

    28