Texas Instruments SM320F2812-HT Benutzerhandbuch
www.ti.com
SGUS062A – JUNE 2009 – REVISED APRIL 2010
2.3
Die Layout
The SM320F2812 die layout is shown in
. See
for a description of each pad's
function.
Figure 2-1. SM320F2812 Die Layout
Table 2-2. Bare Die Information
DIE PAD
DIE PAD
DIE
BACKSIDE
BACKSIDE
DIE SIZE
DIE PAD SIZE
COMPOSITI
COORDINATES
THICKNESS
FINISH
POTENTIAL
ON
219.4 x 207.0 (mils);
Silicon with
55.0 x 64.0 (
m
m)
See
11.0 mils
AlCu/TiN
Ground
5572.0 x 5258.0 (
m
m)
backgrind
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Introduction
15
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